Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent
文献类型：期刊论文
| 作者 | Kang RX(康瑞雪)1,2; Liang J(梁军)1 ; Qiao ZH(乔竹辉)1; Peng ZJ(彭振军)1
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| 刊名 | Journal of The Electrochemical Society
 |
| 出版日期 | 2015 |
| 卷号 | 162期号:10页码:D515-D519 |
| 关键词 | Al-Si alloy copper galvanic replacement deep eutectic solvent growth kinetics pure Al |
| ISSN号 | 0013-4651 |
| 通讯作者 | 梁军 |
| 英文摘要 | The galvanic replacement deposition of copper (Cu) layers from a choline chloride-ethylene glycol deep eutectic solvent was carried out on pure Al (99.99%) and Al-5Si alloy (Al-5 wt% Si alloy). The growth kinetics of Cu galvanic replacement were investigated by open circuit potential (OCP) and electrochemical noise (ECN). The microstructure characteristics of Cu layers were studied by scanning electron microscopy (SEM) and energy dispersive X-ray (EDS) analysis. Results showed that the driving force of Cu galvanic replacement deposition on Al-5Si alloy was weaker than that on pure Al substrate, resulting in the lower galvanic replacement rate of Cu on Al-5Si alloy. The Cu layer on Al-5Si alloy was dense and uniform, while was loose and discontinuous on pure Al. The Si as solid solute in Al matrix of Al-5Si alloy was the main reason for obtaining dense and uniform Cu layer on the substrate. |
| 学科主题 | 材料科学与物理化学 |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China (grant No. 51305432);the "Hundred Talents Program" of Chinese Academy of Sciences (J. Liang) |
| 语种 | 英语 |
| WOS记录号 | WOS:000361501800063 |
| 公开日期 | 2015-12-24 |
| 源URL | [http://210.77.64.217/handle/362003/18661]  |
| 专题 | 兰州化学物理研究所_先进润滑与防护材料研究发展中心 |
| 作者单位 | 1.Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100080, Peoples R China |
| 推荐引用方式 GB/T 7714 | Kang RX,Liang J,Qiao ZH,et al. Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent[J]. Journal of The Electrochemical Society,2015,162(10):D515-D519. |
| APA | Kang RX,Liang J,Qiao ZH,&Peng ZJ.(2015).Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent.Journal of The Electrochemical Society,162(10),D515-D519. |
| MLA | Kang RX,et al."Growth Kinetics of Copper Replacement Deposition on Al and Al-Si from a Deep Eutectic Solvent".Journal of The Electrochemical Society 162.10(2015):D515-D519. |
入库方式： OAI收割
来源：兰州化学物理研究所
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