Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation
文献类型：期刊论文
| 作者 | Wang, TM; Zhou, P; Cao, F; Kang, HJ; Chen, ZN; Fu, YN; Xiao, TQ; Huang, WX; Yuan, QX |
| 刊名 | INTERMETALLICS
 |
| 出版日期 | 2015 |
| 卷号 | 58页码:84—90 |
| 关键词 | LEAD-FREE SOLDER INTERFACIAL REACTIONS IMAGING TECHNOLOGY CURRENT-DENSITY ZN ADDITION MICROSTRUCTURE ALLOYS NI SOLIDIFICATION IMPROVEMENT |
| 英文摘要 | High resolution time-resolved X-ray imaging with synchrotron radiation has been used to in situ observe the growth behavior of Cu6Sn5 intermetallic compounds (IMCs) during solidification in Sn-6.5 Cu and Sn-6.5 Cu-0.2 Al (wt. %) solders under applied direct current (DC) field. The morphological evolution of Cu6Sn5 with I-like, X-like, Y-like and bird-like shapes is directly observed. It is shown that trace levels of Al have a marked effect on the solder microstructures and refining the size of the primary Cu6Sn5. The solidification pathway leading to the refinement is observed in real time using synchrotron microradiography. After adding the trace Al, I-like shapes bifurcate into X-like shapes. Furthermore, when DC field with 10 A/cm(2) is applied, both the growth rate and the mean size of Cu6Sn5 are increased but decreased when 100 A/cm(2) is applied. Meanwhile, the effect of thermodynamic potential barrier caused by DC field on the growth behavior of Cu6Sn5 is discussed. (C) 2014 Elsevier Ltd. All rights reserved. |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2015-12-24 |
| 源URL | [http://ir.sinap.ac.cn/handle/331007/24468]  |
| 专题 | 上海应用物理研究所_中科院上海应用物理研究所2011-2017年 |
| 推荐引用方式 GB/T 7714 | Wang, TM,Zhou, P,Cao, F,et al. Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation[J]. INTERMETALLICS,2015,58:84—90. |
| APA | Wang, TM.,Zhou, P.,Cao, F.,Kang, HJ.,Chen, ZN.,...&Yuan, QX.(2015).Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation.INTERMETALLICS,58,84—90. |
| MLA | Wang, TM,et al."Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation".INTERMETALLICS 58(2015):84—90. |
入库方式： OAI收割
来源：上海应用物理研究所
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