Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package
文献类型：期刊论文
| 作者 | Wu CML; Lai JKL; Wu YL(吴永礼)
|
| 刊名 | COMPOSITE STRUCTURES
 |
| 出版日期 | 1997 |
| 卷号 | 38期号:1-4页码:525-530 |
| ISSN号 | 0263-8223 |
| 产权排序 | City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Hong Kong; Chinese Acad Sci, Inst Mech, Beijing 100080, Peoples R China |
| 通讯作者 | Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong. |
| 中文摘要 | A tape automated bonded (TAB) package is basically a composite structure. A three-dimensional finite element fracture analysis was performed to evaluate the effects of cracks in a TAB package under thermal cycling conditions. The lead-tin solder in the outer lead bond as well as the copper beam lead were taken as elasto-plastic materials. Interface cracks between the copper beam lead and the solder were included in the analysis. It was found that the prescribed cracks created new sources of stress concentrations, which are fairly mild. This result showed that the configuration of the outer lead bonds in TAB packages is generally resilient to thermal cycling, even with the presence of defects such as cracks. (C) 1997 Elsevier Science Ltd. |
| 类目[WOS] | Materials Science, Composites |
| 研究领域[WOS] | Materials Science |
| 关键词[WOS] | INTERCONNECTIONS |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000071253500054 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/58495]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Wu CML,Lai JKL,Wu YL. Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package[J]. COMPOSITE STRUCTURES,1997,38(1-4):525-530. |
| APA | Wu CML,Lai JKL,&吴永礼.(1997).Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package.COMPOSITE STRUCTURES,38(1-4),525-530. |
| MLA | Wu CML,et al."Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package".COMPOSITE STRUCTURES 38.1-4(1997):525-530. |
入库方式： OAI收割
来源：力学研究所
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