Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate
文献类型：期刊论文
| 作者 | Chen PJ ; Chen SH(陈少华); Yao Y(姚寅)
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| 刊名 | JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
 |
| 出版日期 | 2016-02 |
| 卷号 | 83期号:2页码:21007 |
| 通讯作者邮箱 | chenpeijian@cumt.edu.cn ; shchen@LNM.imech.ac.cn |
| 关键词 | contact mechanics nonslipping contact thin film graded substrate finite-thickness |
| ISSN号 | 0021-8936 |
| 产权排序 | [Chen Peijian] China Univ Min & Technol, Sch Mech & Civil Engn, State Key Lab Geomech & Deep Underground Engn, Xuzhou 221116, Jiangsu, Peoples R China; [Chen Shaohua; Yao Yin] Chinese Acad Sci, Inst Mech, LNM, Beijing 100190, Peoples R China |
| 通讯作者 | Chen, PJ (reprint author), China Univ Min & Technol, Sch Mech & Civil Engn, State Key Lab Geomech & Deep Underground Engn, Xuzhou 221116, Jiangsu, Peoples R China. |
| 中文摘要 | The contact behavior of an elastic film subjected to a mismatch strain on a finite-thickness graded substrate is investigated, in which the contact interface is assumed to be nonslipping and the shear modulus of the substrate varies exponentially in the thickness direction. The Fourier transform method is adopted in order to reduce the governing partial differential equations to integral ones. With the help of numerical calculation, the interfacial shear stress, the internal normal stress in the film and the stress intensity factors are predicted for cases with different material parameters and geometric ones, including the modulus ratio of the film to the substrate, the inhomogeneous feature of the graded substrate, as well as the profile of the contacting film. All the physical predictions can be used to estimate the potential failure modes of the film-substrate interface. Furthermore, it is found that the result of a finite-thickness model is significantly different from the prediction of a generally adopted half-plane one. The study should be helpful for the design of film-substrate systems in real applications. |
| 分类号 | 一类/力学重要期刊 |
| 类目[WOS] | Mechanics |
| 研究领域[WOS] | Mechanics |
| 关键词[WOS] | ELASTIC HALF-SPACE ; ADHESIVE CONTACT ; THIN-FILM ; HEAT-GENERATION ; MECHANICS ; EDGE ; SOLIDS ; PLANE ; REINFORCEMENT ; INDENTATION |
| 收录类别 | SCI ; EI |
| 原文出处 | http://dx.doi.org/10.1115/1.4031936 |
| 语种 | 英语 |
| WOS记录号 | WOS:000367373500007 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/58651]  |
| 专题 | 力学研究所_非线性力学国家重点实验室 |
| 推荐引用方式 GB/T 7714 | Chen PJ,Chen SH,Yao Y. Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate[J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,2016,83(2):21007. |
| APA | Chen PJ,Chen SH,&Yao Y.(2016).Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate.JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,83(2),21007. |
| MLA | Chen PJ,et al."Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate".JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME 83.2(2016):21007. |
入库方式： OAI收割
来源：力学研究所
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