Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology
文献类型:期刊论文
作者 | Wang SQ ; Zhou CH(周常河) ; Ru HY ; Zhang YY |
刊名 | appl. optics
![]() |
出版日期 | 2005 |
卷号 | 44期号:21页码:4429 |
关键词 | SURFACE-RELIEF GRATINGS MICROLENSES FABRICATION SIO2 LENS AR |
ISSN号 | 0003-6935 |
中文摘要 | polymer deposition is a serious problem associated with the etching of fused silica by use of inductively coupled plasma (icp) technology, and it usually prevents further etching. we report an optimized etching condition under which no polymer deposition will occur for etching fused silica with icp technology. under the optimized etching condition, surfaces of the fabricated fused silica gratings are smooth and clean. etch rate of fused silica is relatively high, and it demonstrates a linear relation between etched depth and working time. results of the diffraction of gratings fabricated under the optimized etching condition match theoretical results well. (c) 2005 optical society of america. |
收录类别 | EI |
语种 | 英语 |
WOS记录号 | WOS:000230665200001 |
公开日期 | 2009-09-18 |
源URL | [http://ir.siom.ac.cn/handle/181231/1672] ![]() |
专题 | 上海光学精密机械研究所_信息光学开放实验室 |
推荐引用方式 GB/T 7714 | Wang SQ,Zhou CH,Ru HY,et al. Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology[J]. appl. optics,2005,44(21):4429, 4434. |
APA | Wang SQ,周常河,Ru HY,&Zhang YY.(2005).Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology.appl. optics,44(21),4429. |
MLA | Wang SQ,et al."Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology".appl. optics 44.21(2005):4429. |
入库方式: OAI收割
来源:上海光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。