Unidirectional Thermal Diffusion in Bimetallic Cu@Au Nanoparticles
文献类型：期刊论文
| 作者 | Liu, SJ; Sun, ZH; Liu, QH; Wu, LH; Huang, YY; Yao, T; Zhang, J; Hu, TD; Ge, MR; Hu, FC |
| 刊名 | ACS NANO
 |
| 出版日期 | 2014 |
| 卷号 | 8期号:2页码:1886-1892 |
| 关键词 | unidirectional atomic diffusion core@shell nanoparticle in situ X-ray absorption spectroscopy Cu@Au dilute substitutional intermetallic |
| 英文摘要 | Understanding the atomic diffusions at the nanoscale is important for controlling the synthesis and utilization of nanomaterials. Here, using in situ X-ray absorption spectroscopy coupled with theoretical calculations, we demonstrate a so far unexplored unidirectional diffusion from the Au shell to the Cu core in thermally alloying Cu@Au core@shell architecture of ca. 7.1 nm. The initial diffusion step at 423 K is found to be characterized by the formation of a diffusion layer composed of a Au-dilute substitutional CuAu-like intermetallic compound with short Cu Au bond length (2.61 angstrom). The diffusion further happens by the migration of the Au atoms with large disorder into the interior Cu matrix at higher temperatures (453 and 553 K). These results suggest that the structural preference of a CuAu-like compound, along with the nanosized effect, plays a critical role in determining the atomic diffusion dynamics. |
| 学科主题 | Chemistry; Science & Technology - Other Topics; Materials Science |
| 收录类别 | SCI |
| WOS记录号 | WOS:000332059200087 |
| 公开日期 | 2016-05-03 |
| 源URL | [http://ir.ihep.ac.cn/handle/311005/224785]  |
| 专题 | 高能物理研究所_多学科研究中心 |
| 推荐引用方式 GB/T 7714 | Liu, SJ,Sun, ZH,Liu, QH,et al. Unidirectional Thermal Diffusion in Bimetallic Cu@Au Nanoparticles[J]. ACS NANO,2014,8(2):1886-1892. |
| APA | Liu, SJ.,Sun, ZH.,Liu, QH.,Wu, LH.,Huang, YY.,...&胡天斗.(2014).Unidirectional Thermal Diffusion in Bimetallic Cu@Au Nanoparticles.ACS NANO,8(2),1886-1892. |
| MLA | Liu, SJ,et al."Unidirectional Thermal Diffusion in Bimetallic Cu@Au Nanoparticles".ACS NANO 8.2(2014):1886-1892. |
入库方式： OAI收割
来源：高能物理研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。