Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography
文献类型：期刊论文
| 作者 | Wang, TM; Cao, F; Zhou, P; Kang, HJ; Chen, ZN; Fu, YN; Xiao, TQ; Huang, WX; Yuan, QX;黄万霞; Yuan QX(袁清习)
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| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
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| 出版日期 | 2014 |
| 卷号 | 616页码:550-555 |
| 关键词 | Interface diffusion Crystal growth Diffusion coefficient Al/Cu bimetal Synchrotron radiation |
| 英文摘要 | Synchrotron X-ray radiography was used to in situ study the interface diffusion behavior and microstructural evolution during the melting and solidification of Al/Cu bimetal. During the solidification, the dendritic growth around the interface is mainly dominated by the variation of Cu concentration and thermal field. Four transition zones of solute profile around the interface were identified to be I (alpha-Al), II (Al + Al2Cu), III (Al2Cu) and IV (AlCu, Al3Cu4 and Al2Cu3), respectively. During the melting, the concentration variations of Al and Cu around the interface were quantitatively analyzed through the extraction of gray level from sequenced X-ray images. The diffusion coefficients of Cu in liquid Al were calculated from the known concentration variations by an inverse method based on Fick's second law. The diffusion coefficients of Cu in Al were found to follow linear Arrhenius equation dependencies with the pre-exponential factor of 2.83 x 10(-5) m(2) s(-1) and the activation energy of 96.0 kJ mol(-1) in a temperature range of 893-970 K. (C) 2014 Elsevier B.V. All rights reserved. |
| 学科主题 | Chemistry; Materials Science; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| WOS记录号 | WOS:000342654000082 |
| 公开日期 | 2016-05-03 |
| 源URL | [http://ir.ihep.ac.cn/handle/311005/225054]  |
| 专题 | 中国科学院高能物理研究所 |
| 推荐引用方式 GB/T 7714 | Wang, TM,Cao, F,Zhou, P,et al. Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2014,616:550-555. |
| APA | Wang, TM.,Cao, F.,Zhou, P.,Kang, HJ.,Chen, ZN.,...&袁清习.(2014).Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography.JOURNAL OF ALLOYS AND COMPOUNDS,616,550-555. |
| MLA | Wang, TM,et al."Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography".JOURNAL OF ALLOYS AND COMPOUNDS 616(2014):550-555. |
入库方式： OAI收割
来源：高能物理研究所
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