Fabrication and properties of Mn1.56Co0.96Ni0.48O4 free-standing ultrathin chips
文献类型：期刊论文
| 作者 | Jiang CP(蒋春萍)
|
| 刊名 | CERAMICS INTERNATIONAL
 |
| 出版日期 | 2014-07 |
| 卷号 | 40期号:6页码:8405-8409 |
| 关键词 | Sintering Electrical properties Spinel Thermistors |
| 通讯作者 | Chang, AM |
| 英文摘要 | Mn1.56Co0.96Ni0.48O4 (MCN) free-standing ultrathin chips are successfully fabricated by using screen printing. The structure, electrical and IR absorption properties have been investigated as a function of the sintering temperature. The X-ray diffraction, X-ray photoelectron spectroscopy and field emission scanning electron microscope analyses show remarkable improvements in crystallinity, stoichiometry and relative density for MCN chips. From the electrical experimental results, it is found that the resistivity of the chip samples sharply decreases from 2660 to 21.9 Omega cm. Such feature is attributed to the decrease in the grain boundary resistance and the increase in Mn3+/Mn4+ ratio with increasing sintering temperature. Furthermore, Fourier transform infrared spectra show that the absorption bands nu 1 (around 1160 cm(-1)) at 1100 degrees C almost disappears while the others still remain. It is ascribed to the increase in the density of samples. The intensities of symmetry bands nu 2 (850 cm(-1)) are also found to be consistent with an increase in ratio of Mn3+ to Mn4+ ions with increasing sintering temperature. (C) 2014 Elsevier Ltd and Techna Group S.r.l. All rights reserved. |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000335201800094 |
| 公开日期 | 2014-12-04 |
| 源URL | [http://ir.sinano.ac.cn/handle/332007/1651]  |
| 专题 | 苏州纳米技术与纳米仿生研究所_纳米器件及相关材料研究部_蒋春萍团队 |
| 推荐引用方式 GB/T 7714 | Jiang CP. Fabrication and properties of Mn1.56Co0.96Ni0.48O4 free-standing ultrathin chips[J]. CERAMICS INTERNATIONAL,2014,40(6):8405-8409. |
| APA | Jiang CP.(2014).Fabrication and properties of Mn1.56Co0.96Ni0.48O4 free-standing ultrathin chips.CERAMICS INTERNATIONAL,40(6),8405-8409. |
| MLA | Jiang CP."Fabrication and properties of Mn1.56Co0.96Ni0.48O4 free-standing ultrathin chips".CERAMICS INTERNATIONAL 40.6(2014):8405-8409. |
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