Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient
文献类型：期刊论文
| 作者 | Miao, J(苗静); Shen, WJ(沈文江); He, CD; Xue, CY; Xiong, JJ |
| 刊名 | Micro & Nano Letters
 |
| 出版日期 | 2015 |
| 卷号 | 10期号:10页码:4 |
| 关键词 | silicon elemental semiconductors silicon-on-insulator wafer bonding electromechanical effects ultrasonic transducers capacitive transducers micromechanical devices micromachining vibrations membranes finite element analysis reliability capacitance electromechanical coupling coefficient capacitive micromachined ultrasonic transducer impedance matching propagation medium microelectromechanical system capacitive ultrasonic transducer silicon on insulator wafer bonding optimum geometric dimensions membrane mechanical vibration electrical characteristics finite-element analysis operation mode device safety device reliability equivalent stress operation-collapse voltage bottom electrodes glass substrate surface parallel parasitic capacitance Si SiO2 |
| 通讯作者 | Miao, J |
| 英文摘要 | Since the proposing of capacitive micromachined ultrasonic transducer by Khuri Yakub group in 1994 that this kind of transducer occupying the advantages of wide bandwidth, impedance matching well with the propagation medium especially in fluid and air and high sensitivity, has shown a great potential for wide ranges of applications. This Letter reports kind of micro-electro-mechanical systems (MEMS) capacitive ultrasonic transducer with the novel cavities embedded in the device layer of silicon on insulator wafer bonded with a glass substrate. The optimum geometric dimensions are confirmed by both mechanical vibrating of the membrane and the electrical characteristics analysis. Finite-element analysis is adopted to determine the operation mode. The safety and reliability of the proposed device is ensured by the obtained deflections and equivalent stress under operation/collapse voltage. The bottom electrodes of the proposed transducer are fabricated on the top surface of the glass substrate. The parallel parasitic capacitance is reduced, thus improving the electromechanical coupling coefficient. The test results show that the electromechanical coupling coefficient is 69.65%, which demonstrates that this proposed MEMS capacitive ultrasonic transducer structure can enhance the performance significantly. |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2016-05-03 |
| 源URL | [http://ir.sinano.ac.cn/handle/332007/3295]  |
| 专题 | 苏州纳米技术与纳米仿生研究所_纳米器件及相关材料研究部_沈文江团队 |
| 推荐引用方式 GB/T 7714 | Miao, J,Shen, WJ,He, CD,et al. Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient[J]. Micro & Nano Letters,2015,10(10):4. |
| APA | Miao, J,Shen, WJ,He, CD,Xue, CY,&Xiong, JJ.(2015).Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient.Micro & Nano Letters,10(10),4. |
| MLA | Miao, J,et al."Micro-electro-mechanical systems capacitive ultrasonic transducer with a higher electromechanical coupling coefficient".Micro & Nano Letters 10.10(2015):4. |
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