The conduction development mechanism of silicone-based electrically conductive adhesives
文献类型：期刊论文
| 作者 | Yao, YG（姚亚刚）
|
| 刊名 | JOURNAL OF MATERIALS CHEMISTRY C
 |
| 出版日期 | 2013 |
| 卷号 | 1期号:28页码:4368-4374 |
| 关键词 | SILVER FLAKE LUBRICANTS IN-SITU SYNTHESIS THERMAL-DECOMPOSITION THIN INSULATING FILM |
| 通讯作者 | Wong, CP |
| 英文摘要 | The conduction development mechanism of silicone-based electrically conductive adhesives (Silo-ECAs) is studied. The reduction of surfactants on silver flakes by hydride in the silicone backbone and the subsequent sintering of the generated silver nanoparticles between micron-sized silver flakes are found to be the major contributor to the conductivity development in Silo-ECAs; this is in contrast with the mechanism observed in most polymer-metal ECAs, where the curing shrinkage of the polymer matrix is the major cause of conductivity development. The conductivity development in Silo-ECAs ceases when the polymer curing is completed. Hence, in order to enhance the resulting electrical conductivity, the curing process is prolonged by using a long-chain prepolymer, lowering the platinum catalyst concentration, or adding curing inhibitors. A bulk resistivity of 8.82 x 10(-5) Omega cm is achieved, which is 55% lower than the best values reported previously for Silo-ECAs. |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000321015700009 |
| 公开日期 | 2014-01-15 |
| 源URL | [http://ir.sinano.ac.cn/handle/332007/1381]  |
| 专题 | 苏州纳米技术与纳米仿生研究所_先进材料研究部_姚亚刚团队 |
| 推荐引用方式 GB/T 7714 | Yao, YG. The conduction development mechanism of silicone-based electrically conductive adhesives[J]. JOURNAL OF MATERIALS CHEMISTRY C,2013,1(28):4368-4374. |
| APA | Yao, YG.(2013).The conduction development mechanism of silicone-based electrically conductive adhesives.JOURNAL OF MATERIALS CHEMISTRY C,1(28),4368-4374. |
| MLA | Yao, YG."The conduction development mechanism of silicone-based electrically conductive adhesives".JOURNAL OF MATERIALS CHEMISTRY C 1.28(2013):4368-4374. |
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