The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation
文献类型：期刊论文
| 作者 | Yao YG(姚亚刚)
|
| 刊名 | SCIENTIFIC REPORTS
 |
| 出版日期 | 2014-04-24 |
| 卷号 | 4期号:0 |
| 关键词 | POLYMER COMPOSITES NANOCOMPOSITES PARTICLES CONSTANT SILICA MODEL |
| 通讯作者 | Wang, H |
| 英文摘要 | Polymer modified fillers in composites has attracted the attention of numerous researchers. These fillers are composed of core-shell structures that exhibit enhanced physical and chemical properties that are associated with shell surface control and encapsulated core materials. In this study, we have described an apt method to prepare polyimide (PI)-modified aluminum nitride (AlN) fillers, AlN@PI. These fillers are used for electronic encapsulation in high performance polymer composites. Compared with that of untreated AlN composite, these AlN@PI/epoxy composites exhibit better thermal and dielectric properties. At 40 wt% of filler loading, the highest thermal conductivity of AlN@PI/epoxy composite reached 2.03 W/mK. In this way, the thermal conductivity is approximately enhanced by 10.6 times than that of the used epoxy matrix. The experimental results exhibiting the thermal conductivity of AlN@PI/epoxy composites were in good agreement with the values calculated from the parallel conduction model. This research work describes an effective pathway that modifies the surface of fillers with polymer coating. Furthermore, this novel technique improves the thermal and dielectric properties of fillers and these can be used extensively for electronic packaging applications. |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000334841700001 |
| 公开日期 | 2014-12-19 |
| 源URL | [http://ir.sinano.ac.cn/handle/332007/1709]  |
| 专题 | 苏州纳米技术与纳米仿生研究所_先进材料研究部_姚亚刚团队 |
| 推荐引用方式 GB/T 7714 | Yao YG. The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation[J]. SCIENTIFIC REPORTS,2014,4(0). |
| APA | Yao YG.(2014).The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation.SCIENTIFIC REPORTS,4(0). |
| MLA | Yao YG."The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation".SCIENTIFIC REPORTS 4.0(2014). |
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