Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging
文献类型：期刊论文
| 作者 | Zhang, Q. K. ; Long, W. M. ; Zhang, Z. F. |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2015 |
| 卷号 | 646页码:405-411 |
| 关键词 | Lead-free solder Intermetallic compounds 3D imaging Thermal aging Grain boundary |
| ISSN号 | 0925-8388 |
| 通讯作者 | qkzhang@alum.imr.ac.cn ; zhfzhang@imr.ac.cn |
| 收录类别 | SCI |
| 资助信息 | International S&T Cooperation Program of China (ISTCP) [2014DFR50820]; National Basic Research Program of China [2010CB631006] |
| 语种 | 英语 |
| 公开日期 | 2016-04-21 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/74872]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Zhang, Q. K.,Long, W. M.,Zhang, Z. F.. Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2015,646:405-411. |
| APA | Zhang, Q. K.,Long, W. M.,&Zhang, Z. F..(2015).Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging.JOURNAL OF ALLOYS AND COMPOUNDS,646,405-411. |
| MLA | Zhang, Q. K.,et al."Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging".JOURNAL OF ALLOYS AND COMPOUNDS 646(2015):405-411. |
入库方式： OAI收割
来源：金属研究所
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