Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces
文献类型：期刊论文
| 作者 | Zhang, Z. H. ; Li, M. Y. ; Liu, Z. Q. ; Yang, S. H. |
| 刊名 | ACTA MATERIALIA
 |
| 出版日期 | 2016 |
| 卷号 | 104页码:1-8 |
| 关键词 | Intermetallic compounds Microstructure formation mechanism Cu single crystal Orientation Soldering |
| ISSN号 | 1359-6454 |
| 通讯作者 | zhzhang@xmu.edu.cn ; myli@hit.edu.cn |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China [51175116, 51305103]; China Postdoctoral Science Foundation [2013M530153] |
| 语种 | 英语 |
| 公开日期 | 2016-04-21 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/74873]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Zhang, Z. H.,Li, M. Y.,Liu, Z. Q.,et al. Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces[J]. ACTA MATERIALIA,2016,104:1-8. |
| APA | Zhang, Z. H.,Li, M. Y.,Liu, Z. Q.,&Yang, S. H..(2016).Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces.ACTA MATERIALIA,104,1-8. |
| MLA | Zhang, Z. H.,et al."Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces".ACTA MATERIALIA 104(2016):1-8. |
入库方式： OAI收割
来源：金属研究所
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