Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine
文献类型：期刊论文
| 作者 | Ren, Rong ; Xiong, Xuhai ; Ma, Xinghua ; Liu, Siyang ; Wang, Jing ; Chen, Ping ; Zeng, You |
| 刊名 | THERMOCHIMICA ACTA
 |
| 出版日期 | 2016 |
| 卷号 | 623页码:15-21 |
| 关键词 | Epoxy resin Aromatic diamine Curing kinetics Isothermal DSC Diffusion control |
| ISSN号 | 0040-6031 |
| 通讯作者 | xiongxuhai@sau.edu.cn |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China [51303107]; Liaoning Key Laboratory Fundamental Research Project [LZ2015058]; Aerospace Science Foundation of China [2014ZF54030]; National Defense 12th Five-Year Fundamental Research Program [A352010****]; Shenyang National Laboratory for Material Science [2015RP13] |
| 语种 | 英语 |
| 公开日期 | 2016-04-21 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/74935]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Ren, Rong,Xiong, Xuhai,Ma, Xinghua,et al. Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine[J]. THERMOCHIMICA ACTA,2016,623:15-21. |
| APA | Ren, Rong.,Xiong, Xuhai.,Ma, Xinghua.,Liu, Siyang.,Wang, Jing.,...&Zeng, You.(2016).Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine.THERMOCHIMICA ACTA,623,15-21. |
| MLA | Ren, Rong,et al."Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine".THERMOCHIMICA ACTA 623(2016):15-21. |
入库方式： OAI收割
来源：金属研究所
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