中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

文献类型:期刊论文

作者Zhong, Ying ; An, Rong ; Wang, Chunqing ; Zheng, Zhen ; Liu, Zhi-Quan ; Liu, Chin-Hung ; Li, Cai-Fu ; Kim, Tae Kyoung ; Jin, Sungho
刊名SMALL
出版日期2015
卷号11期号:33页码:4097-4103
ISSN号1613-6810
通讯作者wangcq@hit.edu.cn ; jin@ucsd.edu
收录类别SCI
资助信息National Natural Science Foundation of China [51374084]; Iwama Endowed Fund at UC San Diego; Power Electronics Science and Education Development Program of Delta Environmental & Educational Foundation
语种英语
公开日期2016-04-21
源URL[http://ir.imr.ac.cn/handle/321006/74944]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
Zhong, Ying,An, Rong,Wang, Chunqing,et al. Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections[J]. SMALL,2015,11(33):4097-4103.
APA Zhong, Ying.,An, Rong.,Wang, Chunqing.,Zheng, Zhen.,Liu, Zhi-Quan.,...&Jin, Sungho.(2015).Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections.SMALL,11(33),4097-4103.
MLA Zhong, Ying,et al."Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections".SMALL 11.33(2015):4097-4103.

入库方式: OAI收割

来源:金属研究所

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