Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections
文献类型：期刊论文
| 作者 | Zhong, Ying ; An, Rong ; Wang, Chunqing ; Zheng, Zhen ; Liu, Zhi-Quan ; Liu, Chin-Hung ; Li, Cai-Fu ; Kim, Tae Kyoung ; Jin, Sungho |
| 刊名 | SMALL
 |
| 出版日期 | 2015 |
| 卷号 | 11期号:33页码:4097-4103 |
| ISSN号 | 1613-6810 |
| 通讯作者 | wangcq@hit.edu.cn ; jin@ucsd.edu |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China [51374084]; Iwama Endowed Fund at UC San Diego; Power Electronics Science and Education Development Program of Delta Environmental & Educational Foundation |
| 语种 | 英语 |
| 公开日期 | 2016-04-21 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/74944]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Zhong, Ying,An, Rong,Wang, Chunqing,et al. Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections[J]. SMALL,2015,11(33):4097-4103. |
| APA | Zhong, Ying.,An, Rong.,Wang, Chunqing.,Zheng, Zhen.,Liu, Zhi-Quan.,...&Jin, Sungho.(2015).Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections.SMALL,11(33),4097-4103. |
| MLA | Zhong, Ying,et al."Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections".SMALL 11.33(2015):4097-4103. |
入库方式： OAI收割
来源：金属研究所
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