高效公自转轮式抛光技术结构及工艺研究
文献类型：学位论文
| 作者 | 张毅 |
| 学位类别 | 硕士 |
| 答辩日期 | 2015-10 |
| 授予单位 | 中国科学院大学 |
| 导师 | 张学军 |
| 关键词 | 光学加工 计算机辅助表面成型 公自转轮式抛光 去除函数 高 效加工 MATLAB 仿真 收敛效率 |
| 其他题名 | Research of the Structure and Process of An EfficientPolishing technology Combined Self-rotation and Co-rotationmovement |
| 学位专业 | 光学工程 |
| 中文摘要 | 大口径光学系统具有地面像元分辨率高，能量收集能力强的特点，被广泛用 于新一代空间对地观测系统。但是，目前航空航天普遍使用的大口径、超大口径 光学元件，尤其是不具有一般玻璃水解特性的大口径碳化硅元件，材料去除效率 不足的问题尤为突出。如何在保证加工精度的前提下，进一步提高材料去除效率 是目前大口径光学加工中急需解决的难题。 本文通过调研现有计算机控制光学表面成形技术，提出一种全新的公自转轮 式加工方式，能够大幅提高加工时的材料去除效率，同时又可以保持稳定的去除 函数，可以满足粗抛光阶段的大口径非球面加工需求。新装置通过使用轮式磨头 高速自转的加工方式替代现有设备使用的平转动加工方式，相比传统小磨头加工 方式具有以下优点： 1.使用高速自转磨头进行材料去除，同等去除函数束径情况下相较传统小 磨头加工方式去除效率更高。 2.去除函数符合存在中心峰值的类高斯型分布，符合面形收敛要求。 3.方便更换不同尺寸磨头，使用大抛光轮实现高效去除，使用小抛光轮进行 高陡度非球面加工或者边缘加工。 4.与实验室矩阵算法兼容良好，可以实现高效去除和较高的面形收敛效率。 5.机床终端响应快速、更易控制。传统行星运动磨头由于离心运动使得转动 惯量较大，造成响应速度较低，控制难度大。而公自转轮式抛光装置特有的运动 方式使得转动惯量更小，具有更快的响应速度，可以实现运动的精确控制。 根据相关工艺试验，验证了本装置能够实现SiC 材料的高效去除，而且具有 很好的去除稳定性。根据去除函数进行仿真加工的结果表明，在现有算法下，本 装置的去除函数具有很高的收敛效率和加工效率，具有解决现有大口径光学元件制造效率低下难题的潜力。 |
| 英文摘要 | Large aperture optical system with the characteristics of high resolution, high energy collection ability is widely used in the new generation of space to earth observation system. However, At present the large and super large aperture optical components is widely used in the aviation and aerospace field, especially some large diameter silicon carbide elements with no hydrolysis properties have a big problem of low material removal efficiency. How to improve the efficiency of material removal with a high polishing precision is a difficult problem to be solved in the large aperture optical processing. In this paper, we study the existing computer controlled optical surfacing technology. A new polishing method of male self rotating wheel is presented. The material removal efficiency can be greatly improved, and the removal function can be maintained at the same time. It can meet the requirements of large diameter aspheric fabricationg in rough polishing stage. The new device by using wheel spinning compare to the existing equipment by using flat rotation processing has the following advantages: 1. The material removal is carried out by using high-speed rotation of the grinding head, has a higher removal efficiency than the traditional polishing method by the same removal function area. 2. The removal function has the central peak liking the Gauss type distribution,meets the requirements of the surface shaping. 3.Easy to replace different sizes of grinding head meeting various fabricationg needs. 4. It is compatible with matrix algorithm,can finish the surface shaping efficiently and precisely. 5. Traditional planet grinding head movement's rotary inertia is large due to the centrifugal moving motion ,it can't respond quickly in the polishing process. .While the rotary inertia of the rotary wheel polishing device is smaller, the speed of response is faster in the process of precise motion control. According to the related process test, the device can achieve a high efficiency removal of SiC material,and has good removal stability. According to the results of the simulation processing, the removal function of this device has a very high efficiency of convergence, which has the potential to solve the problem of low efficiency in the manufacturing of large aperture optical components. |
| 语种 | 中文 |
| 公开日期 | 2016-05-03 |
| 源URL | [http://ir.ciomp.ac.cn/handle/181722/49277]  |
| 专题 | 长春光学精密机械与物理研究所_中科院长春光机所知识产出 |
| 推荐引用方式 GB/T 7714 | 张毅. 高效公自转轮式抛光技术结构及工艺研究[D]. 中国科学院大学. 2015. |
入库方式： OAI收割
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