中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
The fabrication of thick SiO2 layer by anodization

文献类型:会议论文

作者Ou HY ; Yang QQ ; Lei HB ; Wang QM ; Hu XW
出版日期2000
会议名称international-union-of-materials-research-societies international conference on advanced materials (iumrs-icam 99)
会议日期jun 13-18, 1999
会议地点beijing, peoples r china
关键词thick SiO2 layer porous silicon SiO2/Si waveguide device WAVE-GUIDES SILICON
页码271-275
通讯作者ou hy chinese acad sci inst semicond state key lab integrated optoelect pob 912 beijing 100083 peoples r china.
中文摘要silicon-based silica waveguide (sio2/si) devices have huge applications in optical telecommunication. sio2 up to 25-mu m thick is necessary for some passive sio2/si waveguide devices. oxidizing porous silicon to obtain thick sio2 as cladding layer is presented. the experimental results of porous layer and oxidized porous layer formation were given. the relationship between cracking of sio2 and temperature varying rate was given experimentally. such conclusions are drawn: oxidation rate of porous silicon is several orders faster than that of bulk silicon; appropriate temperature variation rate during oxidation can prevent sio2 on silicon substrates from cracking, and 25 mu m thick silicon dioxide layer has been obtained. (c) 2000 elsevier science b.v. all rights reserved.
英文摘要silicon-based silica waveguide (sio2/si) devices have huge applications in optical telecommunication. sio2 up to 25-mu m thick is necessary for some passive sio2/si waveguide devices. oxidizing porous silicon to obtain thick sio2 as cladding layer is presented. the experimental results of porous layer and oxidized porous layer formation were given. the relationship between cracking of sio2 and temperature varying rate was given experimentally. such conclusions are drawn: oxidation rate of porous silicon is several orders faster than that of bulk silicon; appropriate temperature variation rate during oxidation can prevent sio2 on silicon substrates from cracking, and 25 mu m thick silicon dioxide layer has been obtained. (c) 2000 elsevier science b.v. all rights reserved.; 于2010-11-15批量导入; zhangdi于2010-11-15 17:02:26导入数据到semi-ir的ir; made available in dspace on 2010-11-15t09:02:26z (gmt). no. of bitstreams: 1 2958.pdf: 189607 bytes, checksum: 284250df88da8662287bf0edff27e8ea (md5) previous issue date: 2000; int union mat res soc.; chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china; natl res ctr optoelect technol, beijing 100083, peoples r china
收录类别CPCI-S
会议主办者int union mat res soc.
会议录optical materials, 14 (3)
会议录出版者elsevier science bv ; po box 211, 1000 ae amsterdam, netherlands
学科主题半导体材料
会议录出版地po box 211, 1000 ae amsterdam, netherlands
语种英语
ISSN号0925-3467
源URL[http://ir.semi.ac.cn/handle/172111/14995]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Ou HY,Yang QQ,Lei HB,et al. The fabrication of thick SiO2 layer by anodization[C]. 见:international-union-of-materials-research-societies international conference on advanced materials (iumrs-icam 99). beijing, peoples r china. jun 13-18, 1999.

入库方式: OAI收割

来源:半导体研究所

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