Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels
文献类型：会议论文
| 作者 | Chen HD ; Liang K ; Zeng QM ; Li XJ ; Chen ZB ; Du Y ; Wu RH |
| 出版日期 | 2000 |
| 会议名称 | conference on semiconductor and integrated optoelectronics |
| 会议日期 | 1999 |
| 会议地点 | cardiff, wales |
| 关键词 | MQW MODULATORS EFFECT DEVICE PROGRESS CIRCUITS CMOS |
| 页码 | 2-6 |
| 通讯作者 | chen hd chinese acad sci inst semicond state key lab integrated optoelect beijing 100083 peoples r china. |
| 中文摘要 | hybrid integration of gaas/algaas multiple quantum well self electro-optic effect device (seed) arrays are demonstrated flip-chip bonded directly onto 1 mu m silicon cmos circuits. the gaas/algaas mqw devices are designed for 850 nm operation. some devices are used as input light detectors and others serve as output light modulators. the measurement results under applied biases show good optoelectronic characteristics of elements in seed arrays. nearly the same reflection spectrum is obtained for the different devices at an array and the contrast ratio is more than 1.2:1 after flip-chip bonding and packaging. the transimpedance receiver-transmitter circuit can be operated at a frequency of 300 mhz. |
| 英文摘要 | hybrid integration of gaas/algaas multiple quantum well self electro-optic effect device (seed) arrays are demonstrated flip-chip bonded directly onto 1 mu m silicon cmos circuits. the gaas/algaas mqw devices are designed for 850 nm operation. some devices are used as input light detectors and others serve as output light modulators. the measurement results under applied biases show good optoelectronic characteristics of elements in seed arrays. nearly the same reflection spectrum is obtained for the different devices at an array and the contrast ratio is more than 1.2:1 after flip-chip bonding and packaging. the transimpedance receiver-transmitter circuit can be operated at a frequency of 300 mhz.; 于2010-11-15批量导入; zhangdi于2010-11-15 17:02:27导入数据到semi-ir的ir; made available in dspace on 2010-11-15t09:02:27z (gmt). no. of bitstreams: 1 2962.pdf: 558648 bytes, checksum: d8d136fe15e84b996d87577305c7f3e5 (md5) previous issue date: 2000; chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china; hebei semicond res inst, shijiazhuang 050051, peoples r china |
| 收录类别 | CPCI-S |
| 会议录 | iee proceedings-optoelectronics, 147 (1)
 |
| 会议录出版者 | iee-inst elec eng ; michael faraday house six hills way stevenage, hertford sg1 2ay, england |
| 学科主题 | 光电子学 |
| 会议录出版地 | michael faraday house six hills way stevenage, hertford sg1 2ay, england |
| 语种 | 英语 |
| ISSN号 | 1350-2433 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/15003]  |
| 专题 | 半导体研究所_中国科学院半导体研究所（2009年前） |
| 推荐引用方式 GB/T 7714 | Chen HD,Liang K,Zeng QM,et al. Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels[C]. 见:conference on semiconductor and integrated optoelectronics. cardiff, wales. 1999. |
入库方式： OAI收割
来源：半导体研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。