Microstructure and mechanical property of diamond-like carbon films with ductile copper incorporation
文献类型：期刊论文
| 作者 | Dai, Wei ; Wang, Aiying ; Wang, Qimin |
| 刊名 | SURFACE & COATINGS TECHNOLOGY
 |
| 出版日期 | 2015 |
| 卷号 | 272页码:33-38 |
| ISSN号 | 0257-8972 |
| 公开日期 | 2016-09-18 |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/12437]  |
| 专题 | 宁波材料技术与工程研究所_2015专题 |
| 推荐引用方式 GB/T 7714 | Dai, Wei,Wang, Aiying,Wang, Qimin. Microstructure and mechanical property of diamond-like carbon films with ductile copper incorporation[J]. SURFACE & COATINGS TECHNOLOGY,2015,272:33-38. |
| APA | Dai, Wei,Wang, Aiying,&Wang, Qimin.(2015).Microstructure and mechanical property of diamond-like carbon films with ductile copper incorporation.SURFACE & COATINGS TECHNOLOGY,272,33-38. |
| MLA | Dai, Wei,et al."Microstructure and mechanical property of diamond-like carbon films with ductile copper incorporation".SURFACE & COATINGS TECHNOLOGY 272(2015):33-38. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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