Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler
文献类型：期刊论文
| 作者 | Dai, Wen ; Yu, Jinhong ; Wang, Yi ; Song, Yingze ; Alam, Fakhr E. ; Nishimura, Kazuhito ; Lin, Cheng-Te ; Jiang, Nan |
| 刊名 | JOURNAL OF MATERIALS CHEMISTRY A
 |
| 出版日期 | 2015 |
| 卷号 | 3期号:9 |
| ISSN号 | 2050-7488 |
| 公开日期 | 2016-09-18 |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/12825]  |
| 专题 | 宁波材料技术与工程研究所_2015专题 |
| 推荐引用方式 GB/T 7714 | Dai, Wen,Yu, Jinhong,Wang, Yi,et al. Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler[J]. JOURNAL OF MATERIALS CHEMISTRY A,2015,3(9). |
| APA | Dai, Wen.,Yu, Jinhong.,Wang, Yi.,Song, Yingze.,Alam, Fakhr E..,...&Jiang, Nan.(2015).Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler.JOURNAL OF MATERIALS CHEMISTRY A,3(9). |
| MLA | Dai, Wen,et al."Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler".JOURNAL OF MATERIALS CHEMISTRY A 3.9(2015). |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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