中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling

文献类型:期刊论文

作者Feng, TQ; Xu, JL
刊名applied thermal engineering
出版日期2004-02-01
卷号24期号:2-3页码:323-337
关键词electronic cooling spreading thermal resistance Fourier series three-dimensional
英文摘要a three-dimensional analytical solution using the method of fourier expansion is developed for determination of the spreading thermal resistance of a cubic heat spreader for electronic cooling applications. the model assumes that the heat spreader is receiving a uniform heat flux centroidally with a projected heating area from the heat source. heat is conducted inside the heat spreader in a three-dimensional coordinate, then transferred to a heat sink with a constant convective heat transfer coefficient. dimensionless expressions in the form of infinite series are provided to compute the maximum spreading thermal resistance, the surface temperature fields and the heat flux distribution as a function of relative projected heating area, plate thickness and biot number. the correlation developed herein is effective and accurate to predict the spreading thermal resistance. (c) 2003 elsevier ltd. all rights reserved.
WOS标题词science & technology ; physical sciences ; technology
类目[WOS]thermodynamics ; energy & fuels ; engineering, mechanical ; mechanics
研究领域[WOS]thermodynamics ; energy & fuels ; engineering ; mechanics
关键词[WOS]wick structure ; pipe
收录类别SCI
语种英语
WOS记录号WOS:000187855400014
源URL[http://ir.giec.ac.cn/handle/344007/10203]  
专题中国科学院广州能源研究所
作者单位Chinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou 510070, Peoples R China
推荐引用方式
GB/T 7714
Feng, TQ,Xu, JL. An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling[J]. applied thermal engineering,2004,24(2-3):323-337.
APA Feng, TQ,&Xu, JL.(2004).An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling.applied thermal engineering,24(2-3),323-337.
MLA Feng, TQ,et al."An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling".applied thermal engineering 24.2-3(2004):323-337.

入库方式: OAI收割

来源:广州能源研究所

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