An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling
文献类型:期刊论文
作者 | Feng, TQ; Xu, JL |
刊名 | applied thermal engineering
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出版日期 | 2004-02-01 |
卷号 | 24期号:2-3页码:323-337 |
关键词 | electronic cooling spreading thermal resistance Fourier series three-dimensional |
英文摘要 | a three-dimensional analytical solution using the method of fourier expansion is developed for determination of the spreading thermal resistance of a cubic heat spreader for electronic cooling applications. the model assumes that the heat spreader is receiving a uniform heat flux centroidally with a projected heating area from the heat source. heat is conducted inside the heat spreader in a three-dimensional coordinate, then transferred to a heat sink with a constant convective heat transfer coefficient. dimensionless expressions in the form of infinite series are provided to compute the maximum spreading thermal resistance, the surface temperature fields and the heat flux distribution as a function of relative projected heating area, plate thickness and biot number. the correlation developed herein is effective and accurate to predict the spreading thermal resistance. (c) 2003 elsevier ltd. all rights reserved. |
WOS标题词 | science & technology ; physical sciences ; technology |
类目[WOS] | thermodynamics ; energy & fuels ; engineering, mechanical ; mechanics |
研究领域[WOS] | thermodynamics ; energy & fuels ; engineering ; mechanics |
关键词[WOS] | wick structure ; pipe |
收录类别 | SCI |
语种 | 英语 |
WOS记录号 | WOS:000187855400014 |
源URL | [http://ir.giec.ac.cn/handle/344007/10203] ![]() |
专题 | 中国科学院广州能源研究所 |
作者单位 | Chinese Acad Sci, Guangzhou Inst Energy Convers, Guangzhou 510070, Peoples R China |
推荐引用方式 GB/T 7714 | Feng, TQ,Xu, JL. An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling[J]. applied thermal engineering,2004,24(2-3):323-337. |
APA | Feng, TQ,&Xu, JL.(2004).An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling.applied thermal engineering,24(2-3),323-337. |
MLA | Feng, TQ,et al."An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling".applied thermal engineering 24.2-3(2004):323-337. |
入库方式: OAI收割
来源:广州能源研究所
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