Packaging of Hard Solder 500W QCW Diode Laser Array
文献类型:会议论文
作者 | Li, Xiaoning1![]() ![]() ![]() ![]() |
出版日期 | 2016 |
会议名称 | conference on components and packaging for laser systems ii |
会议日期 | 2016-02-16 |
会议地点 | san francisco, ca |
关键词 | diode laser MCC hard solder high power |
卷号 | 9730 |
通讯作者 | li, xn (reprint author), focuslight technol inc, 56 zhangba 6th rd, xian 710077, shaanxi, peoples r china. |
英文摘要 | the package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. in this work, a novel micro channel cooler (mcc) for stack array laser with good heat dissipation capability and high reliability is presented. numerical simulations of thermal management with different mcc structure are conducted and analyzed. based on this new mcc packaging structure, a series of qcw 500w high power laser arrays with hard solder packaging technology has been fabricated. the performances of the laser arrays are characterized. a narrow spectrum of 3.12 nm and an excellent smile value are obtained. the lifetime of the laser array is more than 1.38x10(9) shots and still ongoing. |
收录类别 | EI ; ISTP |
产权排序 | 1 |
会议录 | components and packaging for laser systems ii
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会议录出版者 | spie-int soc optical engineering |
学科主题 | optics ; physics, applied |
会议录出版地 | bellingham |
语种 | 英语 |
ISSN号 | 0277-786x |
ISBN号 | 978-1-62841-965-8 |
源URL | [http://ir.opt.ac.cn/handle/181661/28324] ![]() |
专题 | 西安光学精密机械研究所_炬光科技有限公司 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
作者单位 | 1.Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China 2.Chinese Acad Sci, Xian Inst Opt & Precis Mech, State Key Lab Transient Opt & Photon, 17 Xinxi Rd,New Ind Pk, Xian 710119, Shaanxi, Peoples R China |
推荐引用方式 GB/T 7714 | Li, Xiaoning,Wang, Jingwei,Hou, Dong,et al. Packaging of Hard Solder 500W QCW Diode Laser Array[C]. 见:conference on components and packaging for laser systems ii. san francisco, ca. 2016-02-16. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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