中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Packaging of Hard Solder 500W QCW Diode Laser Array

文献类型:会议论文

作者Li, Xiaoning1; Wang, Jingwei1; Hou, Dong1; Nie, Zhiqiang2; Liu, Xingsheng1,2
出版日期2016
会议名称conference on components and packaging for laser systems ii
会议日期2016-02-16
会议地点san francisco, ca
关键词diode laser MCC hard solder high power
卷号9730
通讯作者li, xn (reprint author), focuslight technol inc, 56 zhangba 6th rd, xian 710077, shaanxi, peoples r china.
英文摘要the package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. in this work, a novel micro channel cooler (mcc) for stack array laser with good heat dissipation capability and high reliability is presented. numerical simulations of thermal management with different mcc structure are conducted and analyzed. based on this new mcc packaging structure, a series of qcw 500w high power laser arrays with hard solder packaging technology has been fabricated. the performances of the laser arrays are characterized. a narrow spectrum of 3.12 nm and an excellent smile value are obtained. the lifetime of the laser array is more than 1.38x10(9) shots and still ongoing.
收录类别EI ; ISTP
产权排序1
会议录components and packaging for laser systems ii
会议录出版者spie-int soc optical engineering
学科主题optics ; physics, applied
会议录出版地bellingham
语种英语
ISSN号0277-786x
ISBN号978-1-62841-965-8
源URL[http://ir.opt.ac.cn/handle/181661/28324]  
专题西安光学精密机械研究所_炬光科技有限公司
西安光学精密机械研究所_瞬态光学技术国家重点实验室
作者单位1.Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China
2.Chinese Acad Sci, Xian Inst Opt & Precis Mech, State Key Lab Transient Opt & Photon, 17 Xinxi Rd,New Ind Pk, Xian 710119, Shaanxi, Peoples R China
推荐引用方式
GB/T 7714
Li, Xiaoning,Wang, Jingwei,Hou, Dong,et al. Packaging of Hard Solder 500W QCW Diode Laser Array[C]. 见:conference on components and packaging for laser systems ii. san francisco, ca. 2016-02-16.

入库方式: OAI收割

来源:西安光学精密机械研究所

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