Molecular dynamics study of thermal transport across grain boundaries in silicon carbide nanorod
文献类型:期刊论文
作者 | Wang, H; Zhang, W; Wang, CB; Ma, JW; Huai, P |
刊名 | MATERIALS RESEARCH EXPRESS
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出版日期 | 2016 |
卷号 | 3期号:3页码:— |
关键词 | POLYCRYSTALLINE GRAPHENE FUEL-PARTICLES NANOWIRES CONDUCTIVITY RESISTANCE EBSD |
ISSN号 | 2053-1591 |
通讯作者 | Huai, P (reprint author), Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201800, Peoples R China. |
英文摘要 | The thermal transport behaviors of < 011 > Sigma 3, Sigma 9 and Sigma 11 grain boundaries (GBs) in silicon carbide nanorod are investigated by using nonequilibrium molecular dynamics (NEMD) simulation. Temperature changes suddenly at the boundaries if a constant heat flux is assumed. The thermal conductance of these GBs is found several times larger than that of interfaces of other materials previously reported. Furthermore the interfacial thermal resistance increases with elevated temperature above 500 K. Our results give theoretical guidance to understand the underlying thermal transport mechanism in silicon carbide, and may be helpful to design silicon carbide materials for high temperature applications. |
收录类别 | SCI |
语种 | 英语 |
WOS记录号 | WOS:000377811100019 |
源URL | [http://ir.sinap.ac.cn/handle/331007/25775] ![]() |
专题 | 上海应用物理研究所_中科院上海应用物理研究所2011-2017年 |
推荐引用方式 GB/T 7714 | Wang, H,Zhang, W,Wang, CB,et al. Molecular dynamics study of thermal transport across grain boundaries in silicon carbide nanorod[J]. MATERIALS RESEARCH EXPRESS,2016,3(3):—. |
APA | Wang, H,Zhang, W,Wang, CB,Ma, JW,&Huai, P.(2016).Molecular dynamics study of thermal transport across grain boundaries in silicon carbide nanorod.MATERIALS RESEARCH EXPRESS,3(3),—. |
MLA | Wang, H,et al."Molecular dynamics study of thermal transport across grain boundaries in silicon carbide nanorod".MATERIALS RESEARCH EXPRESS 3.3(2016):—. |
入库方式: OAI收割
来源:上海应用物理研究所
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