Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
文献类型:期刊论文
作者 | Yang XS; Wang YJ; Zhai HR; Wang GY; Su YJ; Dai LH(戴兰宏); Ogata S; Zhang TY; Dai LH(戴兰宏)![]() ![]() |
刊名 | JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
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出版日期 | 2016 |
卷号 | 94页码:191-206 |
通讯作者邮箱 | zhangty@shu.edu.cn |
关键词 | Creep Nanotwin Activation parameters HRTEM Atomistic simulations |
ISSN号 | 0022-5096 |
产权排序 | [Yang, Xu-Sheng; Zhang, Tong-Yi] Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China; [Yang, Xu-Sheng; Zhang, Tong-Yi] Shanghai Univ, Shanghai Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China; [Wang, Yun-Jiang; Dai, L. H.] Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China; [Yang, Xu-Sheng; Zhai, Hui-Ru] Hong Kong Univ Sci & Technol, Dept Mech & Aerosp Engn, Kowloon, Hong Kong, Peoples R China; [Wang, Guo-Yong] Jilin Univ, Dept Mat Sci & Engn, Key Lab Automobile Mat, 5988 Renmin St, Changchun 130025, Peoples R China; [Su, Yan-Jing] Univ Sci & Technol Beijing, Key Lab Environm Fracture MOE, Ctr Corros & Protect, Beijing 100083, Peoples R China; [Ogata, Shigenobu] Osaka Univ, Grad Sch Engn Sci, Dept Mech Sci & Bioengn, Osaka 5608531, Japan; [Ogata, Shigenobu] Kyoto Univ, Elements Strategy Initiat Struct Mat, Kyoto 6068501, Japan |
通讯作者 | Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China. ; Zhang, TY (reprint author), Shanghai Univ, Shanghai Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China. |
中文摘要 | In the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 degrees C (RT), 40 degrees C, 50 degrees C, 60 degrees C, and 70 degrees C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinfling could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper. (C) 2016 Elsevier Ltd. All rights reserved. |
分类号 | 一类 |
类目[WOS] | Materials Science, Multidisciplinary ; Mechanics ; Physics, Condensed Matter |
研究领域[WOS] | Materials Science ; Mechanics ; Physics |
关键词[WOS] | Creep ; Nanotwin ; Activation parameters ; HRTEM ; Atomistic simulations |
收录类别 | SCI ; EI |
原文出处 | http://dx.doi.org/10.1016/j.jmps.2016.04.021 |
语种 | 英语 |
WOS记录号 | WOS:000382342300012 |
源URL | [http://dspace.imech.ac.cn/handle/311007/59744] ![]() |
专题 | 力学研究所_非线性力学国家重点实验室 |
推荐引用方式 GB/T 7714 | Yang XS,Wang YJ,Zhai HR,et al. Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2016,94:191-206. |
APA | Yang XS.,Wang YJ.,Zhai HR.,Wang GY.,Su YJ.,...&Wang YJ.(2016).Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,94,191-206. |
MLA | Yang XS,et al."Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 94(2016):191-206. |
入库方式: OAI收割
来源:力学研究所
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