中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Ray-tracing method to analyze and quantify the light enhancement around subsurface defects in transparent materials

文献类型:会议论文

作者Wu, Rong; Zhao, Dongfeng; Zhang, Lei; Shao, Ping; Hua, Neng; Lin, Zunqi
出版日期2014
会议名称conference on high-power lasers and applications vii
通讯作者wu, r (reprint author), chinese acad sci, shanghai inst opt & fine mech, shanghai 201800, peoples r china.
英文摘要laser-induced damage (lid) to optical glass has become a growing problem in high-power laser systems. it is well known that the main reason of glass being damaged is due to defects and impurities in the material. damage caused by subsurface defects (ssds) is especially common in actual system running. accordingly, in the presence of ssds, a simple and alternative calculation method is developed to evaluate the enhancement of light field around the incident and exit surface. this ray tracing approach, based on the classical optics theory, is very direct and clear to show the optical phenomena of light intensity enhancement. some basic ssd shapes have been studied and investigated here, which reveals the importance and boundary condition of controlling the size and density of ssds in grinding and polishing process. finally, to achieve optimal breadth depth ratio, the least etching amounts by hydrofluoric (hf) acid is investigated. the theoretical analysis and simulation results provide an appropriate range of removal amounts, which is very important in the hf etching process.
收录类别CPCI
会议录high-power lasers and applications vii
会议录出版者spie-int soc optical engineering
语种英语
源URL[http://ir.siom.ac.cn/handle/181231/17176]  
专题上海光学精密机械研究所_高功率激光物理国家实验室
作者单位1.[Wu, Rong
2.Zhao, Dongfeng
3.Zhang, Lei
4.Shao, Ping
5.Hua, Neng
6.Lin, Zunqi] Chinese Acad Sci, Shanghai Inst Opt & Fine Mech, Shanghai 201800, Peoples R China
推荐引用方式
GB/T 7714
Wu, Rong,Zhao, Dongfeng,Zhang, Lei,et al. Ray-tracing method to analyze and quantify the light enhancement around subsurface defects in transparent materials[C]. 见:conference on high-power lasers and applications vii.

入库方式: OAI收割

来源:上海光学精密机械研究所

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