中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Microscopic mechanisms of ablation and micromachining of dielectrics by using femtosecond lasers

文献类型:期刊论文

作者Jia, TQ; Xu, ZZ; Li, XX; Li, RX; Shuai, B; Zhao, FL
刊名appl. phys. lett.
出版日期2003
卷号82期号:24页码:4382
通讯作者jia, tq (reprint author), chinese acad sci, shanghai inst opt & fine mech, lab high intens opt, pob 800-211, shanghai 201800, peoples r china
英文摘要we report measurements of damage threshold and ablation depth for sio2 and caf2 irradiated under lasers at wavelengths of 800 and 400 nm for duration of 45-800 fs. these results can be well understood by using a developed avalanche model. the model includes the production of conduction band electrons (cbes), laser energy deposition, and cbe diffusion. the evolution of microexplosion is investigated based on this model. (c) 2003 american institute of physics.
收录类别SCI
语种英语
WOS记录号WOS:000183467500057
版本出版稿
源URL[http://ir.siom.ac.cn/handle/181231/18456]  
专题上海光学精密机械研究所_强场激光物理国家重点实验室
作者单位1.Chinese Acad Sci, Shanghai Inst Opt & Fine Mech, Lab High Intens Opt, Shanghai 201800, Peoples R China
2.Zhongshan Univ, State Key Lab Opt & Elect Mat & Technol, Guangzhou 510275, Peoples R China
推荐引用方式
GB/T 7714
Jia, TQ,Xu, ZZ,Li, XX,et al. Microscopic mechanisms of ablation and micromachining of dielectrics by using femtosecond lasers[J]. appl. phys. lett.,2003,82(24):4382.
APA Jia, TQ,Xu, ZZ,Li, XX,Li, RX,Shuai, B,&Zhao, FL.(2003).Microscopic mechanisms of ablation and micromachining of dielectrics by using femtosecond lasers.appl. phys. lett.,82(24),4382.
MLA Jia, TQ,et al."Microscopic mechanisms of ablation and micromachining of dielectrics by using femtosecond lasers".appl. phys. lett. 82.24(2003):4382.

入库方式: OAI收割

来源:上海光学精密机械研究所

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