大功率半导体激光器组件热特性的研究
文献类型：学位论文
| 作者 | 陈晨 |
| 学位类别 | 硕士 |
| 答辩日期 | 2005 |
| 授予单位 | 中国科学院上海光学精密机械研究所 |
| 导师 | 方祖捷 |
| 关键词 | 半导体激光器 散热 热特性 热弛豫时间 |
| 其他题名 | Study on thermal characteristics of high power semiconductor laser modules |
| 中文摘要 | 半导体激光器具有体积小、重量轻、效率高、寿命长等诸多优点，在国民经济的许多领域得到广泛应用。在过去二十年里，半导体激光器在光纤通信、光盘存储、显示设备和计算机外部设备等领域中起着重要作用。半导体激光器也可作为固体激光器的泵浦源，二极管泵浦的全固态激光器已经成为激光技术和激光工业的一个热点。作为泵浦源，半导体激光器组件需要能提供稳定的高输出功率。高功率半导体激光器的温升是其实际应用中的一个重要问题。温升导致激光器阈值电流增加、发射波长红移、模式的不稳定、器件寿命的降低和其它不利影响。因此，高功率半导体激光器热特性的研究是激光领域的一个重要研究方向，也是本论文的研究内容。本论文内容分为以下几个方面：（l）在简要介绍半导体激光器的发展历程和激射原理后，讨论了激光器内部结构和特性参数的关系，特别是半导体激光器阂值电流和微分外量子效率的温度效应，不同注入电流、占空比下的热耗散功率。对半导体激光器热特性参数：热阻和热弛豫时间，进行了分析和讨论，给出了热特性参数与激光器芯片和热沉参数之间的关系。（2）在不同的工作条件下，测试了808nmGaAs／GaAlAs半导体激光器阵列和9O5nm半导体激光器的各种性能，特别是阈值电流和激射波长的温度关系；通过在不同占空比下光谱测试，获得了不同封装类型半导体激光器的热阻值。（3）分析了半导体激光器有源区温度的动态变化。一般地，温度变化的时间过程是一个可以用热弛豫时间参量来表征的指数变化过程。对于准连续工作、用于固体激光器泵浦源的半导体激光器组件，相对于脉冲宽度短的热弛豫时间由于好的光谱匹配将会有利于提高泵浦效率；对短脉冲工作状态，较大的热弛豫时间会有利于提高峰值输出功率，因为在脉冲持续时间内温升较低。本论文提出了一种新颖的测试半导体热弛豫时间参量的方法，通过使用BOXCAR侧试激光器时间分辨光谱来得到热弛豫时间。（4）对于高功率半导体激光器组件应使用主动冷却技术进行散热。微通道热沉是一种有效的冷却技术。分析了不同热沉结构的热流，根据传热学和流体力学理论，进行了微通道热沉中的热流分析，得到了流体中的温度分布。最后一部分是对本论文简短的总结。 |
| 英文摘要 | Laser diodes have many advantages such as small volume, low weight, high efficiency and long life. Because of these advantages, laser diodes have been applied widely in many fields of national economy. During the last two decades, semiconductor laser has played a key role in fiber communication, disc optical storage, display devices, and computer peripherals etc., and brought along some huge volume industries. Laser diodes can also be used as pumps for solid-state-lasers, and the diode-pumped all-solid-state laser has become a hot spot in laser technology and laser industry. As the pump, semiconductor lasers module with very high output power are demanded both in quality and in quantity. Temperature rise of a high power laser diode is one of the key issues for practical applications. It will cause increase of its threshold, red shift of lasing wavelength, instability of laser modes, decrease of its life-time and other negative affects. Therefore, research on the thermal characteristics of the high power laser diode becomes the most important topic in the field, and is also the subject of this thesis. The content of the thesis can be summarized as follows: After a brief review on the history of laser diode development and laser physics principles, basic relations between the internal structures and the characterization parameters are described and discussed, especially, the temperature dependences of threshold and external differential efficiency, the heat dissipations varied with the applied current and duty cycle. Two parameters for characterizing the thermal performances, i.e., thermal resistance and temperature rise time, are discussed and simulated to understand their relation with the laser chip and heat-sink. The overall characteristics of 808nm GaAs/GaAlAs laser diode arrays and 905nm laser diodes were measured, especially dependence of threshold and lasing wavelength on temperature, under different operation conditions. The thermal resistances of the laser diodes with different packages were calculated by using the measurement of lasing wavelength under different duty cycles. A dynamic variation of the temperature at the laser active region is analyzed. Basically its temporal variation can be described as an exponential process, and characterized by a temperature rise-time. It is shown that for quasi-CW operation of the high power laser diode module as pumps of solid-state laser a smaller rise-time will benefit the pump efficient due-to the better wavelength matching; for short pulse operation, a larger rise-time will benefit the peak output power. A new method to measure the rise-time was proposed and demonstrated experimentally, which was based on the time resolved spectrum by using a gated-averaged amplifier(BOXCAR). Active heat-sinks are absolutely necessary in high power laser diode modules. Among them the micro channeled heat-sink is regarded as the best promising method. The heat flow in different heat-sink structures is analyzed; and a simulation is presented for temperature distribution in a flowing fluid by using equations for fluid velocity field , heat conduction and convection. A brief conclusion is presented in the last chapter. |
| 语种 | 中文 |
| 源URL | [http://ir.siom.ac.cn/handle/181231/16460]  |
| 专题 | 上海光学精密机械研究所_学位论文 |
| 推荐引用方式 GB/T 7714 | 陈晨. 大功率半导体激光器组件热特性的研究[D]. 中国科学院上海光学精密机械研究所. 2005. |
入库方式： OAI收割
来源：上海光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。