光纤金属化及其组件封装工艺研究
文献类型：学位论文
| 作者 | 皮浩洋 |
| 学位类别 | 硕士 |
| 答辩日期 | 2012 |
| 授予单位 | 中国科学院上海光学精密机械研究所 |
| 导师 | 蔡海文 |
| 关键词 | 光电子器件 光纤金属化 化学镀 封装工艺 锁相技术 |
| 其他题名 | Study on Metallization of Optical Fibers and Its Module Packaging |
| 中文摘要 | 光电子器件在通信、传感等技术领域得到了广泛的应用，在实际应用过程中要求此类器件能在潮湿、腐蚀性、真空等环境下长期运行。为了保证器件的长期可靠性，通常将光电子器件封装在气密的金属壳体内。而在光电子器件中光纤耦合输出或者基于光纤的器件应用在光路设计上具有较大的灵活性，在光通信、光传感等领域被广泛采用。为了提高光纤耦合光电子器件的可靠性，可以采用全金属焊接工艺实现光纤的气密封装。此类封装要求光纤具有能与金属材料焊接的表面特性，所以光纤金属化是实现气密封装的重要步骤。而在光纤传感领域广泛应用的光纤光栅，其表面金属化能使光栅具有埋入金属基底时需要的耐高温性和可焊性，从而克服各种有机胶的老化对光栅性能的影响。因此深入研究光纤金属化技术及其组件封装工艺具有重要的实用价值和科学意义。 本文针对金属化光纤在科研项目中的实际应用，对光纤金属化技术及其组件封装工艺进行了系统的研究，提出了光纤端面保护措施，设计了光纤光栅中段金属化夹具，通过优化工艺参数使光纤金属化成品率得到了较大提高。与此同时还对高功率半导体激光器二维锁相技术进行了实验研究。本论文主要内容有以下几个方面： 1）对光纤金属化工艺过程进行了系统的实验研究；分析了镀层表面形貌及镀层的可焊性以及结合力；对化学镀的预处理工艺进行了优化，使化学镀的成品率得到了提高；提出了光纤端面保护的有效方法，避免了金属化工艺过程对光纤端面的影响。 2）设计了光纤中段金属化夹具，通过对金属化夹具和化学镀参数的优化，实现了光纤光栅中段的金属化；在理论上分析了金属镀层的厚度对光栅中心波长漂移的影响，获得相关的理论曲线；在实验上通过对化学镀镍全过程光纤光栅反射光谱的在线监测，得出了不同镀镍层厚度的光纤光栅中心波长的改变量，实验数据与理论分析结果吻合较好。该实验结果为金属化光纤光栅谐振波长的精确控制提供理论的依据和实验数据。 3）实验研究了光纤金属化组件的封装工艺并进行了性能测试；分析了封装工艺中存在的问题和技术难点；并实验研究了保偏光纤金属化组件在半导体激光器蝶形封装中的馈通焊工艺，对比了两种焊料馈通前后对器件的偏振消光比和功率的影响。 4）从研究高功率半导体激光器外腔锁相技术出发，对半导体激光器锁相技术进行了理论分析；采用不同的外腔腔镜实现了对半导体激光器阵列光束质量的改善；搭建了精确测量半导体激光器远场发散角的装置；提出了通过观测光生电流的方法来验证光的相互注入；并利用一个公共条形外腔镜实现了两个快轴准直后高功率半导体激光器阵列慢轴发散角的压窄，其光谱特性也得到一定改善。 |
| 英文摘要 | Optoelectronic devices have been widely applied in communication and sensing fields. Sometimes, those devices are required to work in the humid, corrosive or vacuum environment. In order to guarantee the devices’ reliability working at the harsh environment, it is generally required to package those components in metallic box. Optical fiber coupled and fibers based devices have good flexibility in optical design, so they are widely used in communication and optical sensing. In the Commercial products, the glues are widely used to seal the cover and fiber feedthrough, but the process with glue hardly achieve the real hermetic package and it has weaker adhesive strength, shorter durability, thus the devices with glue cannot be applied in the space environment which need higher reliability. In order to improve the reliability of fiber coupled optoelectronic devices, hermetic package can be achieved by all-metal welding. This kind of package requires the metallization on the surface of fiber. Fiber metallization is an important step to achieve hermetic package. Fiber Bragg Grating (FBG) is widely used as fiber sensor, the surface metallization of the FBG can surfer from higher temperature when sealed in the metal substrate, and overcome the aging influence of the glue. Further study the metallization of optical fiber and its module packaging are very important for practical and scientific value in the related communication industries, electronic technologies, aeronautics and astronautics. In this thesis, the technique of fiber metallization and module packaging for their actual application in the project has been comprehensivly studied. The protection method for the fiber end from the metalized effect is proposed, and special fixtures for the metallization of the middle part of FBG are designed. By optimizing the processing parameters, success rate of the fiber metallization is improved. The main contents of the thesis are summarized as follows: • Fiber metallization process was comprehensively studied; the surface morphology of the plating layer was analyzed. The pre-processing of electroless plating was optimized, and the metallization success rate is increased. An effective method for fiber end protection from the metalized effect was provided. •Special fixtures for the middle part metallization were designed. The fixtures for metallization and electroless plating parameters are optimized, the middle part metallization of the FBGs with different thickness are successively realized; the relationship between the wavelength shift and the thickness of nickel layer was theoretically analyzed, the in-situ observation of the FBG’s wavelength during electroless plating and the wavelength shifting with metal-film thickness were investigated, the results indicate that the theoretical analysis fit well with the experimental data. Theoretical basis and experimental data for precisely controlling the center wavelength of fiber Bragg gratings can be provided. •The metalized fiber modules packaging technique and its performance were experimentally studied; the problems and difficulties in the packaging techniques were also analyzed; the feed-through welding technologies with the metalized fiber modules in the butterfly packaging were studied, the polarization extinction ratio and power before and after welding with two different solders were compared. •External-cavity technique for high-power laser diode array (LDA) was analyzed, the external-cavity technique of semiconductor LDA was theoretically studied, and different external mirrors were employed to improve the beam quality. Accurate measure equipment of semiconductor laser far field angle was built. Light injection was verified by observing the photocurrent. Two fast-axis were collimated by sharing a stripe external mirror, the slow-axis of the LDA was suppressed, and the beam quality is improved. |
| 语种 | 中文 |
| 源URL | [http://ir.siom.ac.cn/handle/181231/16739]  |
| 专题 | 上海光学精密机械研究所_学位论文 |
| 推荐引用方式 GB/T 7714 | 皮浩洋. 光纤金属化及其组件封装工艺研究[D]. 中国科学院上海光学精密机械研究所. 2012. |
入库方式： OAI收割
来源：上海光学精密机械研究所
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