基于PIE方法的三维显微成像技术研究
文献类型：学位论文
| 作者 | 陈文 |
| 学位类别 | 硕士 |
| 答辩日期 | 2016 |
| 授予单位 | 中国科学院上海光学精密机械研究所 |
| 导师 | 刘诚 |
| 关键词 | 相干衍射成像 层析 相干光学 迭代算法 相位恢复 |
| 其他题名 | 3-D Microscopic Imaging Based on PIE Method |
| 中文摘要 | 三维显微成像的优点在于能够比普通二维成像获得更多的样品细节分布信息, 同时立体显示的图像有助于更加直观地观测待测样品并且准确地理解待测样品的三维结构。光束穿过样品时，其强度和相位信息一般会同时被样品调制，但只有强度信息可以直接通过探测器记录，相位信息则受限于探测器的有限响应速度很难被直接检测。光波的相位是其所通过介质的折射率分布的体现，往往比强度包含了更多的介质信息，因此光波相位信息的获取对于材料科学、生物医学等领域有着重要的应用价值。 目前有两种常用的技术可在光学频段实现三维显微成像，一个是相干层析成像技术，一个是激光共聚焦扫描显微成像技术，二者均可获得的光波的三维强度分布，但都不能探测样品内部的折射率分布情况。基于二维扫描的PIE方法提供了一种快速的三维相位和强度同时成像的方法—3PIE，该技术可以使样品内部的透射函数的三维分布情况得以准确重建。本论文围绕基于PIE方法的三维显微成像技术进行系统研究，针对其现存的缺点与不足，有针对性地进行了分析和改进，取得了如下具有创新性的研究成果： 1）分析了单光束PIE中初始猜测照明光的相位倾斜因子对重构结果的影响，并在此基础上提出双光束照明3PIE层析成像，对3PIE层析成像技术进行了改进，大幅度提高其轴向分辨率和收敛速度。 2) 在对样品和探测器距离误差对重建结果影响的问题进行了详细的分析的基础上指出，重建过程中物体到探测器轴向距离误差对再现图像所造成的影响在数学上和横向扫描步长误差所造成的影响相当，并将据此借助衍射光斑丰富的数据冗余度，使用退火算法自动更正距离偏差所带来的影响。 3）搭建了可见光波段的实际验证系统，并对激光损伤样品进行了定性测试。通过对多种样品的实际测试，证明了所提双光束照明的3PIE方法在提高收敛速度和减小层间串扰方面的优越性，并对实际的激光损伤样品进行了测试。 |
| 英文摘要 | The three dimensional microscopic imaging offers more detailed information and the relative position information. Stereoscopic image helps more visually observing the sample and an accurate understanding of the three dimensional structure of the sample. When the light passes through the sample, the intensity and phase information are modulated by the sample simultaneously, but only the intensity information could be directly recorded by the detector, while the direct recording of phase information is difficult to be done due to the limit by the response time of detector. The phase of light is reflected in the distribution of the refractive index of the medium that the light through. The phase of light tends to contain more information than the intensity of light. Obtaining phase information of light can be very important for applications in materials science, biomedical and other fields. Two main technologies in optical band that realize three dimensional microscopic imaging are optical coherence tomography and confocal laser scanning microscopy, both of which can obtain three dimensional intensity information of light. So far all the three dimensional imaging technology cannot detect and image a refractive index distribution of the interior of the sample. Based on two dimensional scanning PIE method, a fast and three dimensional phase imaging method was proposed -3PIE, through which the three dimensional distribution of the transmission function of sample can be reconstructed accurately. In this paper we mainly focused on three-dimensional microscopic imaging technology based on PIE method and targeted to the imaging technology analyses and improvements for shortcomings and deficiencies of the technology. The following innovative research results were achieved: 1) Simulation and analysis were done which related to the phase inclination factor of the illumination light beam influencing the reconstruction results. Based on this result, the dual-beam illuminating 3PIE method was proposed on the basis of the single-beam illuminating 3PIE method with a great improved axial resolution and convergence rate. 2) A detailed analysis relating to the axis distance between sample and detector impact to the reconstruction results was done. On the basis of numerical simulation, we pointed out that in the reconstruction process the axis distance error leads to a horizontal scanning step drift. And accordingly by means of rich data redundancy in diffraction patterns, effects caused by the axis distance error can be automatically corrected by using annealing position-correcting algorithm. 3) The actual verification experimental system using visible light was built and laser-induced damage samples were test qualitatively. Several samples including actual laser-induced damage sample were tested and the results verify the advantages of the proposed method in improving convergence rate and reducing crosstalk between the different slices. |
| 语种 | 中文 |
| 源URL | [http://ir.siom.ac.cn/handle/181231/16977]  |
| 专题 | 上海光学精密机械研究所_学位论文 |
| 推荐引用方式 GB/T 7714 | 陈文. 基于PIE方法的三维显微成像技术研究[D]. 中国科学院上海光学精密机械研究所. 2016. |
入库方式： OAI收割
来源：上海光学精密机械研究所
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