Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications
文献类型：期刊论文
| 作者 | Xia, HY ; Drymiotis, F ; Chen, CL ; Wu, AP ; Chen, YY ; Snyder, GJ |
| 刊名 | JOURNAL OF MATERIALS SCIENCE
 |
| 出版日期 | 2015 |
| 卷号 | 50期号:7页码:2700 |
| 公开日期 | 2016-12-26 |
| 源URL | [http://ir.iphy.ac.cn/handle/311004/60886]  |
| 专题 | 物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xia, HY,Drymiotis, F,Chen, CL,et al. Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications[J]. JOURNAL OF MATERIALS SCIENCE,2015,50(7):2700. |
| APA | Xia, HY,Drymiotis, F,Chen, CL,Wu, AP,Chen, YY,&Snyder, GJ.(2015).Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications.JOURNAL OF MATERIALS SCIENCE,50(7),2700. |
| MLA | Xia, HY,et al."Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications".JOURNAL OF MATERIALS SCIENCE 50.7(2015):2700. |
入库方式： OAI收割
来源：物理研究所
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