The reliability of copper pillar under the coupling of thermal cycling and electric current stressing
文献类型：期刊论文
| 作者 | Ma, HC ; Guo, JD ; Chen, JQ ; Wu, D ; Liu, ZQ ; Zhu, QS ; Zhang, L ; Guo, HY |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2016-09-01 |
| 卷号 | 27期号:9页码:9748-9754 |
| ISSN号 | 0957-4522 |
| 通讯作者 | Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China. |
| 学科主题 | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| 收录类别 | SCI |
| 资助信息 | Natural Science Foundation of China [51171191, 51471180]; Major National Science and Technology Program of China [2011ZX02602] |
| 语种 | 英语 |
| 公开日期 | 2016-12-28 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/76290]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Ma, HC,Guo, JD,Chen, JQ,et al. The reliability of copper pillar under the coupling of thermal cycling and electric current stressing[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(9):9748-9754. |
| APA | Ma, HC.,Guo, JD.,Chen, JQ.,Wu, D.,Liu, ZQ.,...&Guo, HY.(2016).The reliability of copper pillar under the coupling of thermal cycling and electric current stressing.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27(9),9748-9754. |
| MLA | Ma, HC,et al."The reliability of copper pillar under the coupling of thermal cycling and electric current stressing".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.9(2016):9748-9754. |
入库方式： OAI收割
来源：金属研究所
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