High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities
文献类型：期刊论文
| 作者 | Chen, Wei1,2; Ji, Mian1; Yang, Shi-yong1 |
| 刊名 | CHINESE JOURNAL OF POLYMER SCIENCE
 |
| 出版日期 | 2016-08-01 |
| 卷号 | 34期号:8页码:933-948 |
| 关键词 | Polyimide Fluorene Proccessability Thermal stability Composite |
| 英文摘要 | To improve the processability and thermal stability of polyimide, a series of novel phenylethynyl-endcapped oligoimides (PEPA-oligoimides) with calculated molecular weights (M C-n) were successfully prepared from thermal imidization of 4,4'-(9-fluorenylidene) dianiline (BAFL) as fluorenyl diamine, 4,4'-oxy-diphthalic anhydride (ODPA) as aromatic dianhydride and 4-phenylethynylphthalic anhydride (4-PEPA) acted as reactive end-capping reagent at elevated temperatures. Experiment results indicated that the oligoimides were the mixtures of PEPA-endcapped oligomers with different degrees of polymerization characterized by MALDI-TOF mass spectra. The influence of chemical structures on the melt processabilities of the oligoimides, the thermal, dielectric and mechanical properties of the thermoset resins was studied. The typical oligoimide resin owned minimum melt viscosity of 0.2 Pa center dot s at around 310 A degrees C and wide melting processing window, suitable for resin transfer molding (RTM). Besides, its corresponding thermal-cured polyimide resin possessed glass transition temperature (T (g)) as high as 514 A degrees C. The dielectric constants of polyimide resins decreased from 3.15 to 2.80 by reducing the M C-n. The mechanical properties of the polyimide neat resins were improved gradually with increasing M C-n. Finally, the carbon fiber/polyimide (C-f/PI) composite laminates showed excellent mechanical strength retention rate at 350 A degrees C, might be long-term served at extremely high temperature in aerospace and aviation field. |
| 收录类别 | SCI |
| 语种 | 英语 |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/35556]  |
| 专题 | 化学研究所_高技术材料实验室 |
| 作者单位 | 1.Chinese Acad Sci, Inst Chem, Lab Adv Polymer Mat, Beijing 100190, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China |
| 推荐引用方式 GB/T 7714 | Chen, Wei,Ji, Mian,Yang, Shi-yong. High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities[J]. CHINESE JOURNAL OF POLYMER SCIENCE,2016,34(8):933-948. |
| APA | Chen, Wei,Ji, Mian,&Yang, Shi-yong.(2016).High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities.CHINESE JOURNAL OF POLYMER SCIENCE,34(8),933-948. |
| MLA | Chen, Wei,et al."High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities".CHINESE JOURNAL OF POLYMER SCIENCE 34.8(2016):933-948. |
入库方式： OAI收割
来源：化学研究所
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