Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors
文献类型：期刊论文
| 作者 | Wang, Zongrui1,2; Dong, Huanli1,3; Zou, Ye1; Zhao, Qiang1,2; Tan, Jiahui1; Liu, Jie1,4,5; Lu, Xiuqiang1; Xiao, Jinchong6; Zhang, Qichun6; Hu, Wenping1,4,5 |
| 刊名 | ACS APPLIED MATERIALS & INTERFACES
 |
| 出版日期 | 2016-03-30 |
| 卷号 | 8期号:12页码:7919-7927 |
| 关键词 | soft-etching method low-cost electrode bottom-contact organic field-effect transistor micro/nanostructures contact resistance |
| 英文摘要 | Poor charge injection and transport at the electrode/semiconductor contacts has been so far a severe performance hurdle for bottom-contact bottom-gate (BCBG) organic field-effect transistors (OFETs). Here, we have developed a simple, economic, and effective method to improve the carrier injection efficiency and obtained high-performance devices with low cost and widely used source/drain (S/D) electrodes (Ag/Cu). Through the simple electrode etching process, the work function of the electrodes is more aligned with the semiconductors, which reduces the energy barrier and facilitates the charge injection. Besides, the formation of the thinned electrode edge with desirable micro/nanostructures not only leads to the enlarged contact side area beneficial for the carrier injection but also is in favor of the molecular self-organization for continuous crystal growth at the contact/active channel interface, which is better for the charge injection and transport. These effects give rise to the great reduction of contact resistance and the amazing improvement of the low-cost bottom-contact configuration OFETs performance. |
| 收录类别 | SCI |
| 语种 | 英语 |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/35988]  |
| 专题 | 化学研究所_有机固体实验室 |
| 作者单位 | 1.Chinese Acad Sci, Inst Chem, Key Lab Organ Solids, Beijing Natl Lab Mol Sci, Beijing 100190, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China 3.Capital Normal Univ, Dept Chem, Beijing 100089, Peoples R China 4.Tianjin Univ, Sch Sci, Key Lab Mol Optoelect Sci, Tianjin 300072, Peoples R China 5.Collaborat Innovat Ctr Chem Sci & Engn, Tianjin 300072, Peoples R China 6.Nanyang Technol Univ, Sch Mat Sci & Engn, 50 Nanyang Ave, Singapore 639798, Singapore |
| 推荐引用方式 GB/T 7714 | Wang, Zongrui,Dong, Huanli,Zou, Ye,et al. Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors[J]. ACS APPLIED MATERIALS & INTERFACES,2016,8(12):7919-7927. |
| APA | Wang, Zongrui.,Dong, Huanli.,Zou, Ye.,Zhao, Qiang.,Tan, Jiahui.,...&Hu, Wenping.(2016).Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors.ACS APPLIED MATERIALS & INTERFACES,8(12),7919-7927. |
| MLA | Wang, Zongrui,et al."Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors".ACS APPLIED MATERIALS & INTERFACES 8.12(2016):7919-7927. |
入库方式： OAI收割
来源：化学研究所
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