Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure
文献类型：期刊论文
| 作者 | Wei, Ping1,2; Yang, Jiong1,3; Guo, Liang4,5; Wang, Shanyu1; Wu, Lihua1,3; Xu, Xianfan4,5; Zhao, Wenyu2; Zhang, Qingjie2; Zhang, Wenqing3,6; Dresselhaus, Mildred S.7 |
| 刊名 | ADVANCED FUNCTIONAL MATERIALS
 |
| 出版日期 | 2016-08-02 |
| 卷号 | 26期号:29页码:5360-5367 |
| 英文摘要 | Contrary to the conventional belief that the consideration for topological insulators (TIs) as potential thermoelectrics is due to their excellent electrical properties benefiting from the topological surface states, this work shows that the 3D weak TIs, formed by alternating stacks of quantum spin Hall layers and normal insulator (NI) layers, can also be decent thermoelectrics because of their focus on minimum thermal conductivity. The minimum lattice thermal conductivity is experimentally confirmed in Bi14Rh3I9 and theoretically predicted for Bi2TeI at room temperature. It is revealed that the topologically "trivial" NI layers play a surprisingly critical role in hindering phonon propagation. The weak bonding in the NI layers gives rise to significantly low sound velocity, and the localized low-frequency vibrations of the NI layers cause strong acoustic-optical interactions and lattice anharmonicity. All these features are favorable for the realization of exceptionally low lattice thermal conductivity, and therefore present remarkable opportunities for developing high-performance thermoelectrics in weak TIs. |
| WOS标题词 | Science & Technology ; Physical Sciences ; Technology |
| 类目[WOS] | Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| 研究领域[WOS] | Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics |
| 关键词[WOS] | AUGMENTED-WAVE METHOD ; SINGLE DIRAC CONE ; THERMOELECTRIC-MATERIALS ; BI2TE3 ; PERFORMANCE ; EFFICIENCY ; CRYSTALS ; BEHAVIOR ; SURFACE ; ORIGIN |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000382548000021 |
| 源URL | [http://ir.sic.ac.cn/handle/331005/22126]  |
| 专题 | 上海硅酸盐研究所_高性能陶瓷和超微结构国家重点实验室_期刊论文 |
| 作者单位 | 1.Univ Washington, Dept Mat Sci & Engn, Seattle, WA 98195 USA 2.Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China 3.Shanghai Univ, Mat Genome Inst, Shanghai 200444, Peoples R China 4.Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA 5.Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA 6.Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China 7.MIT, 77 Massachusetts Ave, Cambridge, MA 02139 USA |
| 推荐引用方式 GB/T 7714 | Wei, Ping,Yang, Jiong,Guo, Liang,et al. Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure[J]. ADVANCED FUNCTIONAL MATERIALS,2016,26(29):5360-5367. |
| APA | Wei, Ping.,Yang, Jiong.,Guo, Liang.,Wang, Shanyu.,Wu, Lihua.,...&Yang, Jihui.(2016).Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure.ADVANCED FUNCTIONAL MATERIALS,26(29),5360-5367. |
| MLA | Wei, Ping,et al."Minimum Thermal Conductivity in Weak Topological Insulators with Bismuth-Based Stack Structure".ADVANCED FUNCTIONAL MATERIALS 26.29(2016):5360-5367. |
入库方式： OAI收割
来源：上海硅酸盐研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。