Design of half mode substrate integrated waveguide gunn oscillator
文献类型:期刊论文
作者 | Zhong, Cuilin; Xu, Jun; Yu, Fengqi; Wang, Maoyan |
刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
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出版日期 | 2011 |
卷号 | 1期号:11页码:1790-1794 |
英文摘要 | Based on the half mode substrate integrated waveguide (HMSIW) technology, a new type of Gunn diode oscillator was developed. Main emphasis was placed on HMSIW resonant cavity structure. Restrictions on the performance of the oscillators imposed by packaged networks and the self-characteristic of the Gunndiode device have been analyzed and then the HMSIW Gunn oscillator design with higher output power is optimized. This oscillator's performance is characterized by an output power of 13.2 dBm, phase noise less than -97.3 dBc/Hz at 100 kHz, output frequency of 26 GHz and frequency excursion of 40 MHz over a temperature range from 10 degrees C to 75 degrees C. It has some advantages such as planar integration, low cost, small size, good temperature-frequency stability, and low phase noise. |
收录类别 | SCI |
原文出处 | http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6036162 |
语种 | 英语 |
源URL | [http://ir.siat.ac.cn:8080/handle/172644/3186] ![]() |
专题 | 深圳先进技术研究院_集成所 |
作者单位 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY |
推荐引用方式 GB/T 7714 | Zhong, Cuilin,Xu, Jun,Yu, Fengqi,et al. Design of half mode substrate integrated waveguide gunn oscillator[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2011,1(11):1790-1794. |
APA | Zhong, Cuilin,Xu, Jun,Yu, Fengqi,&Wang, Maoyan.(2011).Design of half mode substrate integrated waveguide gunn oscillator.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,1(11),1790-1794. |
MLA | Zhong, Cuilin,et al."Design of half mode substrate integrated waveguide gunn oscillator".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 1.11(2011):1790-1794. |
入库方式: OAI收割
来源:深圳先进技术研究院
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