Optimization of sputtering parameters for Ni–Cr alloy deposition on copper foil as embedded thin film resistor
文献类型：期刊论文
| 作者 | Lai Lifei; Zeng Wenjin; Fu Xianzhu; Sun Rong; Du Ruxu |
| 刊名 | SURFACE & COATINGS TECHNOLOGY
 |
| 出版日期 | 2013 |
| 英文摘要 | Ni–Cr (80/20 at.%) alloy was deposited on the copper foil substrate by DC magnetron sputtering process. Taguchi method was applied to optimize the deposition parameters including sputtering power, substrate temperature, and argon pressure. Sputtering power was found to be the most prominent factor that influenced the electrical properties of Ni–Cr alloy film by employing the range analysis. Embedded thin film resistor (ETFR) with a high resistivity of 6.69 × 10− 4 Ω.cm and a low temperature coefficient of resistance of 374.78 ppm/K was obtained under the optimized deposition conditions. A feasible way was demonstrated to fabricate high-quality Ni–Cr alloy on copper foil as ETFR materials. |
| 收录类别 | SCI |
| 原文出处 | http://www.sciencedirect.com/science/article/pii/S0257897212012765 |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/4449]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | SURFACE & COATINGS TECHNOLOGY |
| 推荐引用方式 GB/T 7714 | Lai Lifei,Zeng Wenjin,Fu Xianzhu,et al. Optimization of sputtering parameters for Ni–Cr alloy deposition on copper foil as embedded thin film resistor[J]. SURFACE & COATINGS TECHNOLOGY,2013. |
| APA | Lai Lifei,Zeng Wenjin,Fu Xianzhu,Sun Rong,&Du Ruxu.(2013).Optimization of sputtering parameters for Ni–Cr alloy deposition on copper foil as embedded thin film resistor.SURFACE & COATINGS TECHNOLOGY. |
| MLA | Lai Lifei,et al."Optimization of sputtering parameters for Ni–Cr alloy deposition on copper foil as embedded thin film resistor".SURFACE & COATINGS TECHNOLOGY (2013). |
入库方式： OAI收割
来源：深圳先进技术研究院
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