SEU Reliability Evaluation of 3D ICs
文献类型：期刊论文
| 作者 | Huiyun Li; Xiaobo Hu; Cuiping Shao; Jianbin Zhou; Guoqing Xu |
| 刊名 | Electronics Letters
 |
| 出版日期 | 2015 |
| 英文摘要 | The single-event-upset (SEU) reliability is a concern for three-dimensional (3D) integrated circuits (ICs), mainly due to the carrier mobility change caused by thermo-mechanical stress from through-silicon vias (TSVs) and the shallow trench isolation (STI). A systematic evaluation method is proposed to identify the vulnerability within 3D ICs at design time. The evaluation flow involves the TSV/STI stress-aware mobility variation calculation, sensitive region marking, insertion of excitation signals and then the simulation of the 3D ICs. This method is able to help 3D IC designers to evaluate and enhance the SEU reliability at design time. |
| 收录类别 | SCI |
| 原文出处 | http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=7042440&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber%3D7042440 |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/6599]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | Electronics Letters |
| 推荐引用方式 GB/T 7714 | Huiyun Li,Xiaobo Hu,Cuiping Shao,et al. SEU Reliability Evaluation of 3D ICs[J]. Electronics Letters,2015. |
| APA | Huiyun Li,Xiaobo Hu,Cuiping Shao,Jianbin Zhou,&Guoqing Xu.(2015).SEU Reliability Evaluation of 3D ICs.Electronics Letters. |
| MLA | Huiyun Li,et al."SEU Reliability Evaluation of 3D ICs".Electronics Letters (2015). |
入库方式： OAI收割
来源：深圳先进技术研究院
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