Performance of Curing Epoxy Resins Containing Non-coplanar Rigid Moieties
文献类型：期刊论文
| 作者 | Qin Jing; Zhang Guoping; Sun Rong; Zhu Guangming; Wong Chingping |
| 刊名 | ACTA POLYMERICA SINICA
 |
| 出版日期 | 2015 |
| 英文摘要 | A kind of aromatic diamine,4',4 ''-(2,2-diphenylethene-1,1-diyl) dibiphenyl-4-amine (TPEDA) containing nonplanar rigid twisted moieties in the molecular structure was used as curing agent to prepare epoxy resins cured composites with commercial epoxy resins (E51). Comparing with conventional diamines (4,4'-diaminodiphenylmethane, DDM and 4,4 '-diaminodiphenylsulfone, DDS), the properties of system E51/TPEDA, such as glass transition temperature, elastic modulus, stress relaxation and creep, thermal expansion, the dielectric constant and dielectric loss, were roundly studied by dynamic mechanic analysis (DMA), thermal mechanic analysis (TMA), impedance analyzer,et al. The results show that the structure of rigid non-specific coplanar diamine TPEDA as epoxy curing agent,can significantly improve the glass transition temperature (258 degrees C), elastic modulus (23.7 MPa) and dimensional stability,while reduce the thermal expansion coefficient of the cured product (CTEI :61.9612 x 10(-6), CTE2 :138.3265 x 10(-6)) dielectric constant (4.76 at 1 kHz) and the dielectric loss (1.93 x 10(-2) at 1 MHz). When TPEDA which contains a special twisted steric structure is introduced into the epoxy resin main chain, it minimizes the strong interaction and tight stacking of the molecular chains and then increases the free volume of the polymers. Furthermore, the abundant rigid moieties in TPEDA used as curing agent can also improve the thermal stability of epoxy resins. Therefore E51/TPEDA can be used for high-density integrated circuit device package. |
| 收录类别 | SCI |
| 原文出处 | http://apps.webofknowledge.com/Search.do?product=WOS&SID=Q2oeyucRwdb5YztaimO&search_mode=GeneralSearch&prID=7a957f9a-dd72-4660-99e2-6931409f704d |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/6642]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | ACTA POLYMERICA SINICA |
| 推荐引用方式 GB/T 7714 | Qin Jing,Zhang Guoping,Sun Rong,et al. Performance of Curing Epoxy Resins Containing Non-coplanar Rigid Moieties[J]. ACTA POLYMERICA SINICA,2015. |
| APA | Qin Jing,Zhang Guoping,Sun Rong,Zhu Guangming,&Wong Chingping.(2015).Performance of Curing Epoxy Resins Containing Non-coplanar Rigid Moieties.ACTA POLYMERICA SINICA. |
| MLA | Qin Jing,et al."Performance of Curing Epoxy Resins Containing Non-coplanar Rigid Moieties".ACTA POLYMERICA SINICA (2015). |
入库方式： OAI收割
来源：深圳先进技术研究院
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。