Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2
文献类型:期刊论文
作者 | Gang Li; Wenjie Zhang; Pengli Zhu; Daoqiang Lu; Tao Zhao; Rong Sun |
刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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出版日期 | 2016 |
英文摘要 | Single-size 400 nm-SiO2 and multi-size 1 and 5 lm-SiO2 were used as fillers in epoxy matrix. The fillers with the larger particle size and multi-size SiO2 particles mixing is beneficial to lower the viscosity and increase the filler loading. Among the composites, the 60 wt% 5 lmSiO2 epoxy composite has the best properties with both low coefficients of thermal expansion (CTE) of 28.8 ppm/C and low viscosity of *50 Pa s, which shows its capability to achieve the required low CTE and viscosity values in the electronic packaging. Different theoretical proposals were used to estimate the CTE. Maxwell–Garnett equation fits the experimental data well. In addition, the mixture law and Bruggeman effective medium theory offer the upper and lower limits to the CTE. |
收录类别 | SCI |
原文出处 | http://link.springer.com/article/10.1007%2Fs10854-015-3781-x |
语种 | 英语 |
源URL | [http://ir.siat.ac.cn:8080/handle/172644/9871] ![]() |
专题 | 深圳先进技术研究院_集成所 |
作者单位 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS |
推荐引用方式 GB/T 7714 | Gang Li,Wenjie Zhang,Pengli Zhu,et al. Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016. |
APA | Gang Li,Wenjie Zhang,Pengli Zhu,Daoqiang Lu,Tao Zhao,&Rong Sun.(2016).Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. |
MLA | Gang Li,et al."Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2016). |
入库方式: OAI收割
来源:深圳先进技术研究院
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