Electromagnetic Interference Suppression and Simultaneous Switching Noise Mitigation in System on Package Using a Lowpass Filter Structure with Embedded Capacitor
文献类型：会议论文
| 作者 | Lei Li; Yunfeng Wang; Lixi Wan; Xiaoli Liu; Rong Sun; Shuhui Yu |
| 出版日期 | 2009 |
| 会议名称 | 2009 11th Electronic Packaging Technology Conference, EPTC 2009 |
| 会议地点 | Shanghai |
| 英文摘要 | System on package (SOP) is an emerging technology, and provides an implementation options for system with small size, especially for mixed-signal systems. However, in such a compact package, noise generated by the digital chip can be easily coupled to the RF IC, and degrade the sensitivity of RF signal. In this paper, a simple and efficient multi-order lowpass filter for EMI and SSN suppression in system on package is implemented with embedded capacitor material. It has good performance in noise isolation with a small size of 10mm*mm. The lowpass filter is designed and simulated by electromagnetic analysis software, HFSS. The insertion loss is below -70dB from1.5GHz to 10GHz. Then, the lowpassfilter is serial with a surface mounted 47nH inductor, and can achieve noise suppression below-50dB from 50MHz to 10GHz, below -60dB from 140MHz to 10GHz, and below - 80dB from 600MHz to 10GHz. That is very promising for system on package application in mixed-signal systems. The structure can also be used in large scale backplanes or motherboards. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/2462]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2009 |
| 推荐引用方式 GB/T 7714 | Lei Li,Yunfeng Wang,Lixi Wan,et al. Electromagnetic Interference Suppression and Simultaneous Switching Noise Mitigation in System on Package Using a Lowpass Filter Structure with Embedded Capacitor[C]. 见:2009 11th Electronic Packaging Technology Conference, EPTC 2009. Shanghai. |
入库方式： OAI收割
来源：深圳先进技术研究院
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