An integrated approach to filling holes in meshes
文献类型:会议论文
作者 | Mingqiang Wei; Jianhuang Wu; Mingyong Pang |
出版日期 | 2010 |
会议名称 | 2010 International Conference on Artificial Intelligence and Computational Intelligence, AICI 2010 |
英文摘要 | Data obtained by scanning 3D models typically contains missing pieces and holes. This paper describes an integrated approach for filling holes in triangular meshes obtained during the process of surface reconstruction, which consists of three steps: triangulation, refinement and smoothing. The approach first generates a minimal triangulation to the hole, and then iteratively subdivides the patching meshes making it assort with the density of surrounding meshes. Finally, geometric optimization is enforced to the patching meshes for improving regularity. The approach can deal with arbitrary holes in oriented connected manifold meshes. Experimental results on several triangular meshes are presented |
收录类别 | EI |
语种 | 英语 |
源URL | [http://ir.siat.ac.cn:8080/handle/172644/2813] ![]() |
专题 | 深圳先进技术研究院_集成所 |
作者单位 | 2010 |
推荐引用方式 GB/T 7714 | Mingqiang Wei,Jianhuang Wu,Mingyong Pang. An integrated approach to filling holes in meshes[C]. 见:2010 International Conference on Artificial Intelligence and Computational Intelligence, AICI 2010. |
入库方式: OAI收割
来源:深圳先进技术研究院
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