Novel spray coating process with polymer material applied in CIS wafer-level-packaging
文献类型：会议论文
| 作者 | Yuechen Zhuang; Daquan Yu; Fengwei Dai; Zhongcai Niu; Wenqi Zhang; Zhenzhong Yong; Guoping Zhang |
| 出版日期 | 2014 |
| 会议名称 | 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 |
| 会议地点 | Singapore, Singapore |
| 英文摘要 | This paper studies a creative spray coating process applied to the forming of sidewall insulation of through silicon via (TSV) in CMOS image sensor (CIS)packaging. In this paper, through controlling the nitrogen gas pressure, rate ofpolymer solution flow and plate temperature, we present a low-temperature-first and high-temperature-last spray coating method. Using this novel spray coating process, one kind of phenolic aldehyde polymer is deposited on the sidewall of though silicon via with the diameter of 65μm and depth of 120μm. To promote the performance of TSV sidewall insulation and electrical interconnection characteristic, the thickness of polymer on the sidewall was aimed to not less than 2μm. The temperature of spray coating process was adjusted to control the viscosity of polymer to achieve the insulation layer thickness target value. Finally, we fabricate the adequate polymer insulation layers in the certain aspect ratio (2:1) TSV structure successfully. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/5641]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2014 |
| 推荐引用方式 GB/T 7714 | Yuechen Zhuang,Daquan Yu,Fengwei Dai,et al. Novel spray coating process with polymer material applied in CIS wafer-level-packaging[C]. 见:2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014. Singapore, Singapore. |
入库方式： OAI收割
来源：深圳先进技术研究院
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