Electroless plating alloy thin-film embedded resistor materials
文献类型：会议论文
| 作者 | Xingsong Su; Lifei Lai; Chang Li; Wenjun Liu; Xian-Zhu Fu; Rong Sun; C. P. Wong |
| 出版日期 | 2015 |
| 会议名称 | The 16th International Conference on electronic packing Technology (ICEPT 2015) |
| 会议地点 | Changsha,China |
| 英文摘要 | Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films’ sheet resistance, corrosion resistance and hardness increase with the increase of P content. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/6752]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2015 |
| 推荐引用方式 GB/T 7714 | Xingsong Su,Lifei Lai,Chang Li,et al. Electroless plating alloy thin-film embedded resistor materials[C]. 见:The 16th International Conference on electronic packing Technology (ICEPT 2015). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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