Thermally conductive adhesives based on silver coated copper flake fillers
文献类型：会议论文
| 作者 | Jin-Qi Xie; Hu-Ming Ren; Kai Zhang; Matthew M.F.Yuen; S.W.Ricky Lee; Xian-Zhu Fu; Rong Sun; Ching-Ping Wong |
| 出版日期 | 2015 |
| 会议名称 | The 16th International Conference on electronic packing Technology (ICEPT 2015) |
| 会议地点 | Changsha,China |
| 英文摘要 | In this paper, we reported thermally conductive adhesives filled with Ag-coated Cu flakes and investigated the effect of adhesive composition on the thermal conductive performance. Results revealed that the thermal conductivity increased by increasing the content of Ag coated Cu filler and 16 W/mK can be obtained with 90 wt.% Ag coated Cu filler content |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/6753]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2015 |
| 推荐引用方式 GB/T 7714 | Jin-Qi Xie,Hu-Ming Ren,Kai Zhang,et al. Thermally conductive adhesives based on silver coated copper flake fillers[C]. 见:The 16th International Conference on electronic packing Technology (ICEPT 2015). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。