Facile Synthesis of Elliptical Cu-Ag Nanoplates forElectrically Conductive Adhesives
文献类型：会议论文
| 作者 | Yu Zhang; Pengli Zhu; Gang Li; Baotan Zhang; Rong Sun; Ching-Ping Wong |
| 出版日期 | 2015 |
| 会议名称 | The 16th International Conference on electronic packing Technology (ICEPT 2015) |
| 会议地点 | Changsha,China |
| 英文摘要 | Elliptical Cu-Ag alloy nanoplates were facile prepared through the in situ substitutional reaction between the as-prepared copper microsized particles and silver ions. The highly purified and uniform Cu-Ag alloy nanoplates, which present a size of 700*500*70 nm, were used as filler to prepare the conductive adhesive in epoxy resin system. After heattreatment at 170 °C for 60 min, the resistivity of the conductive films is 7.7×10-4 Ω·cm, which is about the same level as commercial conductive adhesives. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/6756]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2015 |
| 推荐引用方式 GB/T 7714 | Yu Zhang,Pengli Zhu,Gang Li,et al. Facile Synthesis of Elliptical Cu-Ag Nanoplates forElectrically Conductive Adhesives[C]. 见:The 16th International Conference on electronic packing Technology (ICEPT 2015). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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