Preparation of Reversible Thermosets and Their Application in Temporary Adhesive for Thin Wafer Handling
文献类型：会议论文
| 作者 | Libo. Deng; Haoming. Fang; Xingtian. Shuai; Guoping. Zhang; C. P. Wong and Rong |
| 出版日期 | 2015 |
| 会议名称 | Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th |
| 会议地点 | San Diego, California, USA |
| 英文摘要 | Adhesive materials are the key component in the whole temporary bonding/debonding process for thin wafer handling. In this study, a reversible thermoset was synthesized by polycondensation between methyl diamine and aldehydes and was used as the basic resin for temporary adhesive. The use of thermoset endows the adhesive with excellent thermal and chemical stabilities. Moreover, the thermoset can be depolymerized to recover the monomers at a low pH and thus the adhesion was switched off by soaking in strong acids. A perforated glass wafer was bonded with a silicon wafer using the thermoset-based adhesive. It was shown the bonded pair can be separated after soaking in acids. It was further demonstrated that the debonding efficiency can be increased by optimizing the distribution and diameter of the holes in the carrier. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/6763]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2015 |
| 推荐引用方式 GB/T 7714 | Libo. Deng,Haoming. Fang,Xingtian. Shuai,et al. Preparation of Reversible Thermosets and Their Application in Temporary Adhesive for Thin Wafer Handling[C]. 见:Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. San Diego, California, USA. |
入库方式： OAI收割
来源：深圳先进技术研究院
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