Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode
文献类型：会议论文
| 作者 | Baotan Zhang; Rong Sun; Yankang Han; Pengli Zhu; Daoqiang(Daniel) Lu; Chingping Wong |
| 出版日期 | 2016 |
| 会议名称 | China Semiconductor Technology International Conference 2016, CSTIC 2016 |
| 会议地点 | Shanghai, China |
| 英文摘要 | The curing behavior and kinetics of alicyclic epoxy resin (ERL-4221) and bisphenol F epoxy resin (DER-354) using triarylsulfonium hexafluoroantimonates(TASH) as the cationic initiators were studied by differential scanning calorimetry (DSC) at different heating rates. Kinetic parameters of the curing process were calculated and established by the Kissinger, Ozawa and Crane methods. The results showed that the activity of ERL-4221 system was obviously higher than that of DER-354 system in the cationic polymerization system initiated by TASH. Non-Isothermal DSC experiments have confirmed these findings. At the same time, the the kinetic parameters of ERL-4221 and DER-354 systems were corresponding to 87.04 kJ/mol, 2.15×108s-1, 0.9763 and 75.56 kJ/mol, 4.81 × 106s-1, 0.9610, by the Kissinger and Crane method, and the curing reactions both followed the first order reaction kinetics mechanism. The Ozawa method also obtained similar results. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10094]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Baotan Zhang,Rong Sun,Yankang Han,et al. Cure kinetics study of a Novel Die Attach Adhesive for High Power Light-Emitting Diode[C]. 见:China Semiconductor Technology International Conference 2016, CSTIC 2016. Shanghai, China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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