3D graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity
文献类型：会议论文
| 作者 | Sheng-Yun Huang; Yaqiang Ji; Haoran Wen; Kai Zhang; Matthew M.F. Yuen; Xian-Zhu Fu; Rong Sun; C.P. Wong |
| 出版日期 | 2016 |
| 会议名称 | China Semiconductor Technology International Conference 2016, CSTIC 2016 |
| 会议地点 | Shanghai, China |
| 英文摘要 | Graphene foam (GF), carbon fibers (CFs) and GF/CFs reinforced epoxy resin composites were fabricated and their thermal properties were investigated. Due to continuous interconnected structures of GF and avoiding the CFs aggregation in epoxy resin, GF/CFs reinforced epoxy resin demonstrates greatly higher thermal conductivity than the single GF or CFs reinforced epoxy, which could provide a strong candidate for highly thermal conductive polymer composites. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10101]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Sheng-Yun Huang,Yaqiang Ji,Haoran Wen,et al. 3D graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity[C]. 见:China Semiconductor Technology International Conference 2016, CSTIC 2016. Shanghai, China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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