Underfill Technology for Fine Pitch Flip Chip Application
文献类型：会议论文
| 作者 | Pengli Zhu; Gang Li; Qian Guo; Tao Zhao; Daoqiang Lu; Rong Sun; Chingping Wong |
| 出版日期 | 2016 |
| 会议名称 | The 17th International Conference on electronic packing Technology (ICEPT 2016) |
| 会议地点 | Changsha,China |
| 英文摘要 | The advances of flip-chip technology have driven the development of both underfilling processes and underfill materials. With the flip chip scaling to fine pitch and small gaps, nano-sized filler has become an alternative choice to conventional micron-sized filler for underfill applications. On one hand, due to the large surface area of the nanofiller, polymer based nanocomposites exhibite improved mechanical performance and optical transmission properties than their microcomposites counterpart with the same filler loading. While on the other hand, poorly dispersed nanofillers will inevitably deteriorate the rheological and thermo-mechanical properties. Therefore, application of silica nanoparticles as fillers in the preparation of underfill is still a big challenge. In our work, we mainly focused on the following three aspects: (1) preparation of spherical SiO2 filler with various size distribution by traditional Stöber method; (2) underfill formulation research with emphasis on the effect of dispersant and toughener on the effect of rheological and toughness properties; (3) underfilling processing and reliability analysis. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10109]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Pengli Zhu,Gang Li,Qian Guo,et al. Underfill Technology for Fine Pitch Flip Chip Application[C]. 见:The 17th International Conference on electronic packing Technology (ICEPT 2016). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。