A highly sensitive flexible capacitive pressure sensor based on micro-array dielectric layer and silver nanowires
文献类型：会议论文
| 作者 | Xingtian Shuai; Pengli Zhu; Yougen Hu; Qian Guo; Haibo Su; Yankang Han; Rong Sun; Chingping Wong |
| 出版日期 | 2016 |
| 会议名称 | The 17th International Conference on electronic packing Technology (ICEPT 2016) |
| 会议地点 | Changsha,China |
| 英文摘要 | The application of flexible pressure sensors is gradually extended to electronic skins, wearable sensing devices, and humanoid robotics, which are the key to realize artificial intelligence that can contact with humans directly, and to the biomedical applications such as smart prosthesis. In the aforementioned advanced applications, high sensing capability, fast response, high working stability are essential features for the flexible pressure sensors. Although the surface microstructure treatments for electrodes of pressure sensors have been applied to improve sensitivity, the complex process raises the cost and become an obstacle to large-scale manufacturing. In this study, a highly sensitive, low-cost, transparent and flexible capacitive pressure sensor with micro-array polydimethylsiloxane (PDMS) dielectric layer has been developed using a facile fabrication strategy. The pressure sensor was fabricated by integrating PDMS substrates, micro-array PDMS dielectric layer and silver nanowires (AgNWs) electrode layers. The as-fabricated flexible pressure sensor shows high sensitivity (>2.1 kPa−1), fast response (<100 ms) and high cycle stability (>5000 times). The facile fabrication process can be easily scaled up to form pressure sensor arrays, which can be applied to wearable sensing devices or electronic skins. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10112]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Xingtian Shuai,Pengli Zhu,Yougen Hu,et al. A highly sensitive flexible capacitive pressure sensor based on micro-array dielectric layer and silver nanowires[C]. 见:The 17th International Conference on electronic packing Technology (ICEPT 2016). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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